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HT46R73D-3 Dual Slope A/D Type 8-Bit OTP MCU with LCD
Features
* Operating voltage: * Internal 12kHz RC oscillator * External 32.768kHz Crystal oscillator * HALT function and wake-up feature reduce power
fSYS=4MHz: 2.2V~5.5V fSYS=8MHz: 3.3V~5.5V
* Three system oscillators:
consumption
* Voltage regulator (3.3V) and charge pump * Embeded voltage reference generator (1.5V) * 4-level subroutine nesting * Bit manipulation instruction * 15-bit table read instruction * Up to 0.5ms instruction cycle with 8MHz system clock
External Crystal oscillator External RC oscillator Internal RC oscillator
* Up to 16 bidirectional I/O lines * One external interrupt input shard with an I/O lines * One 8-bit and two 16-bit programmable timer/event
counter with overflow interrupt a 8-stage pre-scalar
* LCD driver with 164 segments * 4K15 program memory * 1288 data memory RAM * Single differential input channel dual slope Analog to
at VDD=5V
* 63 powerful instructions * All instructions in 1 or 2 machine cycles * Low voltage reset function * One vibration sensor input * Four touch-key inputs * 52-pin QFP package
Digital Converter with Operational Amplifier.
* Watchdog Timer with regulator power * Buzzer output
General Description
The HT46R73D-3 is an 8-bit high performance, RISC architecture microcontroller device specifically designed for A/D with LCD applications that interface directly to analog signals, such as those from sensors. The advantages of low power consumption, I/O flexibility, timer functions, oscillator options, Dual slope A/D converter, LCD display, HALT and wake-up functions, watchdog timer, as well as low cost, enhance the versatility of these devices to suit for a wide range of AD with LCD application possibilities such as sensor signal processing, scales, consumer products, subsystem controllers, etc.
Rev. 1.10
1
April 19, 2010
HT46R73D-3
Block Diagram
M U X Prescaler TMR0 M U X fSYS LF
TMR0C TMR0 Interrupt Circuit STACK Program ROM Program Counter INTC TMR1C TMR1
M U X
Prescaler TMR1
M U X
fSYS/4 LF
Instruction Register
MP
M U X
DATA Memory
TMR2C TMR2
M U X
Prescaler TMR2
M U X
fSYS/4 TCKF
fWDT WDT Prescaler Instruction Decoder fRTC ALU RTC OSC Timing Generator Shifter STATUS LVR Circuits 1-Channel Dual-Slope Converter with OP BP ACC LCD Memory LCD DRIVER PBC Regulator VOREG VMAX VLCD COM0~COM3 SEG0~SEG15 PB Touch Key circuits Port B PB0/TK0 PB1/TK1 PB2/TK2 PB3/TK3 PAC PA Amplifier Port A DOPAP DOPAO DSRR DSCC DOPAN DCHOP DSRC TH/LB MUX HALT EN/DIS WDT M U X fRTC fSYS/4
WDT OSC
OSC4
OSC3
OSC2
OSC1 RES VDD VSS
PA0/VIB PA5/OSC2 PA1/BZ PA6/OSC1 PA2/BZ/KREF PA7/RES PA3/OSC4 PA4/OSC3
VDD CHPC1 CHPC2 VOCHP
Charge Pump
Vibration Sensor input PB4/INT/SEG0 PB5/TMR0/SEG1 PB6/TMR1/SEG2 PB7/TMR2/SEG3
Touch Key inputs
Pin Assignment
P A 2 /B Z /L PB0 PB1 PB2 PB3 PA3 [A 4 PA5 PA6 /O /O /O
V C V V C
D D
D
D
AVD T H /L OBG HPC HPC OCH ORE AVS N OPA OPA OPA CHO O
D B P
1 2 3
52 51 50 49 48 47 46 45 44 43 42 41 40
PA0 PA /O
39 38 37
/V IB 1 /B Z SC4 SC3 SC2 SC1 VDD VSS REF /T K 0 /T K 1 /T K 2 /T K 3 PB4 PB5 PB6 PB7 SEG SEG SEG SEG SEG SEG SEG SEG SEG /S E /S E /S E /S E 4 5 6 7 8 9 10 11 12 G 0 /IN G 1 /T G 2 /T G 3 /T T MR0 MR1 MR2
2 P 1
5 6 7 8 4
36 35
G C N P S
H T 4 6 R 7 3 D -3 5 2 Q F P -A
9 10 11 12
P
13
14 15 16 17 18 19 20 21 22 23 24 25 26
34 33 32 31 30 29 28 27
SEG SEG SEG COM COM COM COM VLC VMA PA7 DSC DSR DSR 13 14 15 3 2 1 0 D X /R E S C R C
Rev. 1.10
2
April 19, 2010
HT46R73D-3
Pin Description
Pin Name I/O Options Description
PA0/VIB PA1/BZ PA2/BZ/KREF PA3/OSC4 PA4/OSC3 PA5/OSC2 PA6/OSC1 PA7/RES
I/O
Bidirectional 8-bit input/output port. Each individual bit on this port can be configured to have a wake-up function using a configuration option. Software instructions determine if the pin is a CMOS output or Schmitt Trigger input. Configuration options determine which pins on this port have pull-high resistors except for PA7. VIB is the vibration sensor analog input which is pin-shared with PA0. BZ and BZ are buzzer outputs pin-shared with PA1 and PA2 and are to be used as buzzer outputs or normal I/O functions deterPull-high mined by configuration options. KREF is the reference oscillator Wake-up input for the touch key function. OSC1 and OSC2 can be used as Buzzer 32.768kHz Crystal system oscillator pins which are pin-shared with PA6 and PA5. System oscillator Configuration options determine if these pins are used as I/O pins or system oscillator pins. OSC3 and OSC4 can be configured to RES be used as the 32.768kHz oscillator pins or as the normal I/O pins named PA4 and PA3 using a configuration option. RES is pin-shared with PA7 determined by a configuration option. When PA7 is configured as an I/O pin, software instructions determine if this pin is open drain output or Schmitt Trigger input without pull-high resistor. For PA2/BZ/KREF pin, KREF has a higher priority than BZ if both of them are enabled at same time. Bidirectional 8-bit input/output port. Software instructions determine if the pin is a CMOS output or Schmitt Trigger input. Configuration options determine which pins on this port have pull-high resistors. TK0~TK3 are touch sensor input pins which are pin-shared with PB0~PB3. PB4~PB7 are pin-shared with INT, TMR0, TMR1 and TMR2 and also with the LCD segments SEG0~SEG3 respectively which are selected by Software instructions. Once these pins are selected as segments, the I/O function including Schmitt trigger input and pull-high are all disabled. However, these pins will default to an input mode with pull-high resistors after a reset. LCD segment outputs LCD common outputs IC maximum voltage, connect to VDD or VLCD. LCD power supply Band gap voltage output pin. (for internal use) 3/4 3/4 3/4 3/4 Charge pump capacitor (Negative) Regulator output 3.3V Charge pump output - a capacitor is required to be connected Charge pump capacitor (Positive) Dual Slope A/D converter pre-stage OPA related pins. DOPAN is the OPA Negative input pin, DOPAP is the OPA Positive input pin, DOPAO is the OPA output pin and DCHOP is the OPA Chopper pins. Temperature sensor/Low battery voltage input pin.
PB0/TK0 PB1/TK1 PB2/TK2 PB3/TK3 PB4/INT/SEG0 PB5/TMR0/SEG1 PB6/TMR1/SEG2 PB7/TMR2/SEG3
I/O
Pull-high
SEG4~SEG15 COM0~COM3 VMAX VLCD VOBGP VOREG VOCHP CHPC1 CHPC2 DOPAN, DOPAP, DOPAO, DCHOP TH/LB
O O 3/4 I AO O O 3/4 3/4
3/4 3/4 3/4 3/4
AI/AO
3/4
Rev. 1.10
3
April 19, 2010
HT46R73D-3
Pin Name DSRR, DSRC, DSCC VDD VSS AVDD AVSS I/O Options 3/4 3/4 3/4 3/4 3/4 Description Dual slope A/D converter main function RC circuit. DSRR is the input or reference signal, DSRC is the Integrator negative input, and DSCC is the comparator negative input. Digital positive power supply Digital Negative Power supply, ground Analog positive power supply Analog negative power supply, ground
AI/AO 3/4 3/4 3/4 3/4
Absolute Maximum Ratings
Supply Voltage ...........................VSS-0.3V to VSS+6.0V Input Voltage..............................VSS-0.3V to VDD+0.3V IOL Total ..............................................................150mA Total Power Dissipation .....................................500mW Storage Temperature ............................-50C to 125C Operating Temperature...........................-20C to 85C IOH Total............................................................-100mA
Note: These are stress ratings only. Stresses exceeding the range specified under Absolute Maximum Ratings may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.
D.C. Characteristics
Test Conditions Symbol Parameter VDD VDD Operating Voltage Operating Current (Crystal OSC, Ext. RC OSC, Int. RC OSC) 3/4 3/4 5V Conditions fSYS=4MHz fSYS=8MHz No load, fSYS=8MHz, analog block off No load, fSYS=4MHz, ADC block off No load, fSYS=2MHz, ADC block off VREGO=3.3V, fSYS=4MHz, ADC on, ADCCCLK= 125kHz (all other analog devices off) No load, system HALT, LCD off at HALT No load, system HALT, LCD off at HALT, ADC off No load, system HALT, LCD off at HALT, ADC off 2.2 3.3 3/4 3/4 3/4 3/4 3/4 3/4 3/4 4 0.8 2.5 0.5 1.5 5.5 5.5 8 1.5 4 1 3 Min. Typ. Max.
Ta=25C Unit V V mA mA mA mA mA
IDD1
IDD2
Operating Current (Crystal OSC, 3V Ext. RC OSC, Int. RC OSC) 5V Operating Current (Crystal OSC, Ext. RC OSC) 3V 5V
IDD3
IDD4
Operating Current (Crystal OSC, Ext. RC OSC)
5V
3/4
3
5
mA
ISTB1
Standby Current (WDT Disable) Standby Current (WDT Enable)
3V 5V 3V 5V
3/4 3/4 3/4 3/4 3/4 3/4
3/4 3/4 2.5 8 2 6
1 2 5 15 5 10
mA mA mA mA mA mA
ISTB2
ISTB3
Standby Current (WDT Disable In- 3V ternal RC 12kHz OSC ON) 5V
Rev. 1.10
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HT46R73D-3
Test Conditions Symbol Parameter VDD 3V ISTB4 Standby Current (WDT Disable) Conditions No load, system osc HALT, internal RC 12kHz OSC On, ADC block Off, LCD ON (1/3 bias) at HALT, VLCD=VDD No load, system HALT RTC osc slowly start-up No load, system osc Off, RTC OSC On, ADC block Off, LCD On (1/3 bias), VLCD=VDD No load, Only vibration sensor turn on & VIB pin connected a 0.1mF cap to VSS 3/4 3/4 3/4 3/4 3/4 Configuration option: 2.1V VLVR Low Voltage Reset 3/4 Configuration option: 3.15V Configuration option: 4.2V VLVD IOL1 Low Voltage Detector Sink Current for I/O ports except PA7 Source Current for I/O ports except PA7 LCD Common and Segment Current LCD Common and Segment Current Sink Current for PA7 Pull-high Resistance of I/O Ports 5V VPOR RPOR tPOR VDD Start Voltage to ensure Power-on Reset VDD Rise Rate to ensure Power-on Reset Power-on Reset Low Pulse Width 3/4 3/4 3/4 3/4 3V 5V 3V 5V 3V 5V 3V 5V 5V 3V VOL=0.1VDD 3/4 3/4 3/4 3/4 3/4 VOH=0.9VDD VOL=0.1VDD VOH=0.9VDD VOL=0.1VDD 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 0 0.7VDD 0 0.9VDD 0 1.98 2.98 3.98 2.2 4 10 -2 -5 210 350 -80 -180 2 20 10 3/4 0.035 1 43 55 mA mA mA mA mA mA mA mA V V V V V V V V V mA mA mA mA mA mA mA mA mA kW kW mV V/ms ms Min. Typ. Max. Unit
5V 3V 5V 3V
58 3/4 3/4 30 60 2 8 3/4 3/4 3/4 3/4 3/4 2.10 3.15 4.20 2.3 8 20 -4 -10 420 700 -160 -360 3 60 30 3/4 3/4 3/4
80
ISTB5
Standby Current (Internal RC 12kHz OSC Off, RTC On)
5 15 60 120 4 16 0.3VDD VDD 0.4VDD VDD VDD 2.22 3.32 4.42 2.4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 100 50 100 3/4 3/4
ISTB6
Standby Current (WDT Disable)
5V 3V
ISTB7
Standby Current (WDT Disable) Input Low Voltage for I/O Ports, TMR0, TMR1, TMR2 and INT pins Input High Voltage for I/O Ports, TMR0, TMR1, TMR2 and INT pins Input Low Voltage (RES) Input High Voltage (RES) LCD Highest Voltage
5V 3/4 3/4 3/4 3/4 3/4
VIL1 VIH1 VIL2 VIH2 VLCD
IOH1
IOL2
IOH2 IOL3 RPH
Rev. 1.10
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April 19, 2010
HT46R73D-3
Test Conditions Symbol VVIBWK Parameter VDD Minimum Voltage to Wake MCU by the Vibration Sensor Input 3/4 Conditions 100Hz~1KHz sine wave (note) 250 3/4 3/4 mV Min. Typ. Max. Unit
Charge Pump and Regulator VCHPI VREGO VREGDP1 Regulator Output Voltage Drop (Compare with No Load) VREGDP2 Dual Slope AD, Amplifier and Band Gap VRFGTC VADOFF VICMR Note: 1. V Reference Generator Temperature Coefficient Input Offset Range Common Mode Input Range 3/4 3/4 3/4 3/4 @3.3V 3/4 Amplifier, no load Integrator, no load 3/4 3/4 0.2 1.2 50 500 3/4 3/4 3/4 800 VREGO-1.2 VREGO-0.2 Ppm/C mV V V 3/4 Input Voltage Output Voltage 3/4 3/4 3/4 Charge pump on Charge pump off No load VDD=3.7V~5.5V Charge pump off Current10mA VDD=2.4V~3.6V Charge pump on Current6mA 2.2 3.7 3 3/4 3/4 3/4 3.3 100 3.6 5.5 3.6 3/4 V V V mV
3/4
100
3/4
mV
DD
tP
OR
RR
POR
V
POR
T im e
2. Test Circuits for VVMBWK
V
0 .1 m F T o V IB P in AC V t
V IB W K
S in e W a v e
Rev. 1.10
6
April 19, 2010
HT46R73D-3
A.C. Characteristics
Test Conditions Symbol Parameter VDD System Clock (External RC OSC) 2.2V~ 5.5V 2.2V~ 5.5V System Clock (Crystal OSC) 3.3V~ 5.5V 4.5V~ 5.5V 3V/5V Ta=25C 5V Ta=25C Conditions 3/4 3/4 3/4 3/4 400 400 400 400 -2% -2% -5% -5% -8% -8% -8% -12% -12% -12% -2% -5% -7% -11% 0 45 32 1 3/4 3/4 1 0.25 3/4 3/4 3/4 3/4 4/8 12 4/8 12 4 4/8 12 4 4/8 12 4 4 4 4 3/4 90 65 3/4 1024 1024 * 3/4 1.00 4000 4000 8000 12000 +2% +2% +5% +5% +8% +8% +8% +12% +12% +12% -2% -5% -7% -11% 4000 180 130 3/4 3/4 3/4 3/4 2.00 kHz kHz kHz kHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz kHz ms ms ms tSYS tSYS ms ms Min. Typ. Max. Unit Ta=25C
fSYS
3V/5V Ta=0~70C 5V Ta=0~70C
2.2V~ Ta=0~70C 3.6V fHIRC Internal RC OSC 3.0V~ Ta=0~70C 5.5V 4.5V~ Ta=0~70C 5.5V 2.2V~ Ta=-40~85C 3.6V 3.0V~ Ta=-40~85C 5.5V 4.5V~ Ta=-40~85C 5.5V 5V 5V fERC External RC OSC 5V Ta=25C, R=120kW Ta=0~70C, R=120kW Ta=-40~85C, R=120kW
2.2V~ Ta=-40~85C, R=120kW 5.5V fTIMER Timer I/P Frequency (TMR0/TMR1/TMR2) 2.2V~ 5.5V 3V 5V tRES tSST tINT tLVR External Reset Low Pulse Width System Start-up Timer Period (Wake-up from HALT) Interrupt Pulse Width Low Voltage Width to Reset 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 fSYS=Crystal Oscillator fSYS= fERC or fHIRC 3/4 3/4
tWDTOSC Watchdog Oscillator Period
Note: tSYS= 1/fSYS * When the system clock comes from the external RC or internal RC oscillator, the system start-up time period can be 2 or 1024 clock cycles determined by a configuration option.
Rev. 1.10
7
April 19, 2010
HT46R73D-3
Functional Description
Execution Flow The system clock is derived from a crystal, an external RC or internal RC oscillator. It is internally divided into four non-overlapping clocks. One instruction cycle consists of four system clock cycles. Instruction fetching and execution are pipelined in such a way that a fetch takes one instruction cycle while decoding and execution takes the next instruction cycle. The pipelining scheme makes it possible for each instruction to be effectively executed in a cycle. If an instruction changes the value of the program counter, two cycles are required to complete the instruction. Program Counter - PC The program counter (PC) is 12 bits wide and it controls the sequence in which the instructions stored in the program ROM are executed. The contents of the PC can specify a maximum of 4096 addresses. After accessing a program memory word to fetch an instruction code, the value of the PC is incremented by 1. The PC then points to the memory word containing the next instruction code. When executing a jump instruction, conditional skip execution, loading a PCL register, a subroutine call, an initial reset, an internal interrupt, an external interrupt, or returning from a subroutine, the PC manipulates the program transfer by loading the address corresponding to each instruction. The conditional skip is activated by instructions. Once the condition is met, the next instruction, fetched during the current instruction execution, is discarded and a dummy cycle replaces it to get a proper instruction; otherwise proceed to the next instruction. The lower byte of the PC (PCL) is a readable and writeable register (06H). Moving data into the PCL performs a short jump. The destination is within 256 locations.
S y s te m O S C 2 (R C
C lo c k o n ly ) PC
T1
T2
T3
T4
T1
T2
T3
T4
T1
T2
T3
T4
PC
PC+1
PC+2
F e tc h IN S T (P C ) E x e c u te IN S T (P C -1 )
F e tc h IN S T (P C + 1 ) E x e c u te IN S T (P C )
F e tc h IN S T (P C + 2 ) E x e c u te IN S T (P C + 1 )
Execution Flow Program Counter *11 0 0 0 0 0 0 0 *10 0 0 0 0 0 0 0 *9 0 0 0 0 0 0 0 *8 0 0 0 0 0 0 0 *7 0 0 0 0 0 0 0 *6 0 0 0 0 0 0 0 *5 0 0 0 0 0 0 0 *4 0 0 0 0 1 1 1 *3 0 0 1 1 0 0 1 *2 0 1 0 1 0 1 0 *1 0 0 0 0 0 0 0 *0 0 0 0 0 0 0 0
Mode Initial Reset External Interrupt Timer/Event Counter 0 Overflow Timer/Event Counter 1 Overflow Timer/Event Counter 2 Overflow ADC Interrupt Touch Key interrupt Skip Loading PCL Jump, Call Branch Return From Subroutine
Program Counter+2 *11 #11 S11 *10 #10 S10 *9 #9 S9 *8 #8 S8 @7 #7 S7 @6 #6 S6 @5 #5 S5 @4 #4 S4 @3 #3 S3 @2 #2 S2 @1 #1 S1 @0 #0 S0
Program Counter Note: *11~*0: Program counter bits #11~#0: Instruction code bits 8 S11~S0: Stack register bits @7~@0: PCL bits April 19, 2010
Rev. 1.10
HT46R73D-3
When a control transfer takes place, an additional dummy cycle is required.
* Location 014H
Program Memory
The program memory is used to store the program instructions which are to be executed. It also contains data, table, and interrupt entries, and is organized into 409615 bits which are addressed by the program counter and table pointer. Certain locations in the ROM are reserved for special usage:
* Location 000H
Location 014H is reserved for the ADC interrupt service program. If an ADC interrupt occurs, and if the interrupt is enabled and the stack is not full, the program begins execution at this location.
* Location 018H
Location 018H is reserved for the touch key interrupt service program. If a touch key interrupt occurs, and if the interrupt is enabled and the stack is not full, the program begins execution at this location.
* Table location
Location 000H is reserved for program initialization. After chip reset, the program always begins execution at this location.
* Location 004H
Location 004H is reserved for the external interrupt service program. If the INT input pin is activated, and the interrupt is enabled, and the stack is not full, the program begins execution at location 004H.
* Location 008H
Location 008H is reserved for the Timer/Event Counter 0 interrupt service program. If a timer interrupt results from a Timer/Event Counter 0 overflow, and if the interrupt is enabled and the stack is not full, the program begins execution at location 008H.
* Location 00CH
Any location in the ROM can be used as a look-up table. The instructions TABRDC [m] (the current page, 1 page=256 words) and TABRDL [m] (the last page) transfer the contents of the lower-order byte to the specified data memory, and the contents of the higher-order byte to TBLH (Table Higher-order byte register) (08H). Only the destination of the lower-order byte in the table is well-defined; the other bits of the table word are all transferred to the lower portion of TBLH. The TBLH is read only, and the table pointer (TBLP) is a read/write register (07H), indicating the table location. Before accessing the table, the location should be placed in TBLP. All the table related instructions require 2 cycles to complete the operation. These areas may function as a normal ROM depending upon the users requirements.
000H 004H 008H 00CH 010H 014H 018H 100H 1FFH nFFH F00H FFFH D e v ic e In itia liz a tio n P r o g r a m E x te r n a l In te r r u p t S u b r o u tin e T im e r /E v e n t C o u n te r 0 In te r r u p t S u b r o u tin e T im e r /E v e n t C o u n te r 1 In te r r u p t S u b r o u tin e T im e r /E v e n t C o u n te r 2 In te r r u p t S u b r o u tin e A /D C o n v e r te r In te r r u p t S u b r o u tin e
Location 00CH is reserved for the Timer/Event Counter 1 interrupt service program. If a timer interrupt results from a Timer/Event Counter 1 overflow, and if the interrupt is enabled and the stack is not full, the program begins execution at location 00CH.
* Location 010H
Location 010H is reserved for the Timer/Event Counter 2 interrupt service program. If a timer interrupt results from a Timer/Event Counter 2 overflow, and if the interrupt is enabled and the stack is not full, the program begins execution at this location.
P ro g ra m M e m o ry
T o u c h K e y In te r r u p t S u b r o u tin e L o o k - u p T a b le ( 2 5 6 W o r d s )
L o o k - u p T a b le ( 2 5 6 W o r d s ) 1 5 b its
Program Memory
Instruction(s) TABRDC [m] TABRDL [m]
Table Location *11 P11 1 *10 P10 1 *9 P9 1 *8 P8 1 *7 @7 @7 *6 @6 @6 *5 @5 @5 *4 @4 @4 *3 @3 @3 *2 @2 @2 *1 @1 @1 *0 @0 @0
Table Location Note: *11~*0: Table location bits @7~@0: Table pointer bits P11~P8: Current program counter bits
Rev. 1.10
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April 19, 2010
HT46R73D-3
Stack Register - STACK The stack register is a special part of the memory used to save the contents of the program counter. The stack is organized into 4 levels and is neither part of the data nor part of the program, and is neither readable nor writeable. Its activated level is indexed by a stack pointer (SP) and is neither readable nor writeable. At the start of a subroutine call or an interrupt acknowledgment, the contents of the program counter is pushed onto the stack. At the end of the subroutine or interrupt routine, signaled by a return instruction (RET or RETI), the contents of the program counter is restored to its previous value from the stack. After chip reset, the SP will point to the top of the stack. If the stack is full and a non-masked interrupt takes place, the interrupt request flag is recorded but the acknowledgment is still inhibited. Once the SP is decremented (by RET or RETI), the interrupt is serviced. This feature prevents stack overflow, allowing the programmer to use the structure easily. Likewise, if the stack is full, and a CALL is subsequently executed, a stack overflow occurs and the first entry is lost (only the most recent 4 return addresses are stored).
00H 01H 02H 03H 04H 05H 06H 07H 08H 09H 0AH 0BH 0CH 0DH 0EH 0FH 10H 11H 12H 13H 14H 15H 16H 17H 18H 19H 1AH 1BH 1CH 1DH 1EH 1FH 20H 21H 22H 23H 24H 25H 26H 27H 28H 29H 40H W DTC W DTD IN T C 1 CHPRC TM R2H TM R2L TM R2C CFCR0 CFCR1 ANCS0 H ALTC LCDO UT CTRL1 V IB R C G e n e ra l P u rp o s e D a ta M e m o ry (1 2 8 B y te s ) :U nused R e a d a s "0 0 " ADCR ADCD TM R0 TM R0C TM R1H TM R1L TM R1C PA PAC PB PBC S p e c ia l P u r p o s e D a ta M e m o ry IA R 0 MP0 IA R 1 MP1 BP ACC PCL TBLP TBLH CTRL0 STATUS IN T C 0
Data Memory - RAM
Bank 0 of the data memory has a capacity of 1288 bits, and is divided into two functional groups, namely the special function registers of 378 bit capacity and the general purpose data memory of 968 bit capacity. Most locations are readable/writable, although some are read only. The special function register are overlapped in all banks. Any unused space before 40H is reserved for future expanded usage, reading these locations will get 00H. The general purpose data memory, addressed from 40H to BFH , is used for data and control information under instruction commands. All of the data memory areas can handle arithmetic, logic, increment, decrement and rotate operations directly. Except for some dedicated bits, each bit in the data memory can be set and reset by the SET [m].i and CLR [m].i instructions. They are also indirectly accessible through the memory pointer registers, MP0 and MP1. Bank 1 contains the LCD Data Memory locations. After first setting up BP to the value of 01H to access Bank 1 this bank must then be accessed indirectly using the Memory Pointer MP1. With BP set to a value of 01H, using MP1 to indirectly read or write to the data memory areas with addresses from 40H~4FH will result in operations to Bank 1. Directly addressing the Data Memory will always result in Bank 0 being accessed irrespective of the value of BP.
BFH
RAM Mapping Indirect Addressing Register Location 00H and 02H are indirect addressing registers that are not physically implemented. Any read/write operation of [00H] and [02H] accesses the RAM pointed to by MP0 (01H) and MP1 (03H) respectively. Reading location 00H or 02H indirectly returns the result 00H. While, writing it indirectly leads to no operation. The memory pointer register, MP0 and MP1, are 8-bit registers.
Rev. 1.10
10
April 19, 2010
HT46R73D-3
The function of data movement between two indirect addressing registers is not supported. The memory pointer registers, MP0 and MP1, are both 8-bit registers used to access the RAM by combining corresponding indirect addressing registers. MP0 can only be applied to data memory, while MP1 can be applied to data memory and LCD display memory. Accumulator - ACC The accumulator (ACC) is related to the ALU operations. It is also mapped to location 05H of the RAM and is capable of operating with immediate data. The data movement between two data memory locations must pass through the ACC. Arithmetic and Logic Unit - ALU This circuit performs 8-bit arithmetic and logic operations and provides the following functions:
* Arithmetic operations (ADD, ADC, SUB, SBC, DAA) * Logic operations (AND, OR, XOR, CPL) * Rotation (RL, RR, RLC, RRC) * Increment and Decrement (INC, DEC) * Branch decision (SZ, SNZ, SIZ, SDZ etc.)
register, however, may yield different results from those intended. The TO and PDF flags can only be changed by a Watchdog Timer overflow, chip power-up, or clearing the Watchdog Timer and executing the HALT instruction. The Z, OV, AC, and C flags reflect the status of the latest operations. On entering the interrupt sequence or executing the subroutine call, the status register will not be automatically pushed onto the stack. If the contents of the status is important, and if the subroutine is likely to corrupt the status register, the programmer should take precautions and save it properly. Interrupts The device provides one external interrupts, three internal timer/event counter interrupts, an ADC interrupt and touch key interrupt. The interrupt control register 0 (INTC0;0BH) and interrupt control register 1 (INTC1;1EH) both contain the interrupt control bits that are used to set the enable/ disable status and interrupt request flags. Once an interrupt subroutine is serviced, other interrupts are all blocked, by clearing the EMI bit). This scheme may prevent any further interrupt nesting. Other interrupt requests may take place during this interval, but only the interrupt request flag will be recorded. If a certain interrupt requires servicing within the service routine, the EMI bit and the corresponding bit of the INTC0 or of INTC1 may be set in order to allow interrupt nesting. Once the stack is full, the interrupt request will not be acknowledged, even if the related interrupt is enabled, until the SP is decremented. If immediate service is desired, the stack should be prevented from becoming full. All interrupts will provide a wake-up function. As an interrupt is serviced, a control transfer occurs by pushing the contents of the program counter onto the stack folFunction
The ALU not only saves the results of a data operation but also changes the status register. Status Register - STATUS The status register (0AH) is 8 bits wide and contains, a carry flag (C), an auxiliary carry flag (AC), a zero flag (Z), an overflow flag (OV), a power down flag (PDF), and a watchdog time-out flag (TO). It also records the status information and controls the operation sequence. Except for the TO and PDF flags, bits in the status register can be altered by instructions similar to other registers. Data written into the status register does not alter the TO or PDF flags. Operations related to the status Bit No. 0 Label C
C is set if an operation results in a carry during an addition operation or if a borrow does not take place during a subtraction operation; otherwise C is cleared. C is also affected by a rotate through carry instruction. AC is set if an operation results in a carry out of the low nibbles in addition or no borrow from the high nibble into the low nibble in subtraction; otherwise AC is cleared. Z is set if the result of an arithmetic or logic operation is zero; otherwise Z is cleared. OV is set if an operation results in a carry into the highest-order bit but not a carry out of the highest-order bit, or vice versa; otherwise OV is cleared. PDF is cleared by either a system power-up or executing the CLR WDT instruction. PDF is set by executing the HALT instruction. TO is cleared by a system power-up or executing the CLR WDT or HALT instruction. TO is set by a WDT time-out. Unused bit, read as 0 Status (0AH) Register
1 2 3 4 5 6~7
AC Z OV PDF TO 3/4
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lowed by a branch to a subroutine at the specified location in the Program Memory. Only the contents of the program counter is pushed onto the stack. If the contents of the register or of the status register is altered by the interrupt service program which corrupts the desired control sequence, the contents should be saved in advance. An external interrupt is triggered by an edge transition on INT (A configuration option selects: high to low, low to high, both low to high and high to low), and the related interrupt request flag (EIF; bit 4 of INTC0) is set as well. After the interrupt is enabled, the stack is not full, and the external interrupt is active, a subroutine call to location 04H occurs. The interrupt request flag (EIF) and EMI bits are all cleared to disable other maskable interrupts. The internal Timer/Event Counter 0 interrupt is initialized by setting the Timer/Event Counter 0 interrupt request flag (T0F; bit 5 of INTC0), which is normally caused by a timer overflow. After the interrupt is enabled, and the stack is not full, and the T0F bit is set, a subroutine call to location 08H occurs. The related interrupt request flag (T0F) is reset, and the EMI bit is cleared to disable other maskable interrupts. Timer/Event Counter 1 and Timer/Event Counter 2 are operated in the same manner but its related interrupt request flag is T1F and T2F (bit 6 of INTC0 and bit 4 of INTC1) and its subroutine call location is 0CH and 10H. The A/D Converter interrupt is initialized by setting the A/D Converter interrupt request flag (ADF; bit 5 of INTC1), that is caused by an A/D conversion done signal. After the interrupt is enabled, and the stack is not full, and the ADF bit is set, a subroutine call to location 14H occurs. The related interrupt request flag (ADF) is reset and the EMI bit is cleared to disable further maskable interrupts. During the execution of an interrupt subroutine, other maskable interrupt acknowledgments are all held until the RETI instruction is executed or the EMI bit and the related interrupt control bit are set both to 1 (if the stack is not full). To return from the interrupt subroutine, RET or RETI may be invoked. RETI sets the EMI bit and enables an interrupt service, but RET does not. Interrupts occurring in the interval between the rising edges of two consecutive T2 pulses are serviced on the latter of the two T2 pulses if the corresponding interrupts are enabled. In the case of simultaneous requests, the priorities in the following table apply. These can be masked by resetting the EMI bit.
Bit No. 0 1 2 3 4 5 6 7
Label EMI EEI ET0I ET1I EIF T0F T1F 3/4
Function Controls the master (global) interrupt (1=enabled; 0=disabled) Controls the external interrupt (1=enabled; 0=disabled) Controls the Timer/Event Counter 0 interrupt (1=enabled; 0=disabled) Controls the Timer/Event Counter 1 interrupt (1=enabled; 0=disabled) External interrupt request flag (1=active; 0=inactive) Internal Timer/Event Counter 0 request flag (1=active; 0=inactive) Internal Timer/Event Counter 1 request flag (1=active; 0=inactive) For test mode used only. Must be written as 0; otherwise may result in unpredictable operation. INTC0 Register
Bit No. 0 1 2 3 4 5 6 7
Label ET2I EADI TKE 3/4 T2F ADF TKF 3/4
Function Control the Timer/Event Counter 2 interrupt (1=enabled; 0=disabled) Control the ADC interrupt (1=enabled; 0=disabled) Control touch key interrupt (1=enabled; 0=disabled) Unused bit, read as 0 Internal Timer/Event Counter 2 request flag (1=active; 0=inactive) ADC request flag (1=active; 0=inactive) Touch key interrupt (1=active; 0=inactive) Unused bit, read as 0 INTC1 Register
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Interrupt Source External interrupt Timer/Event Counter 0 overflow Timer/Event Counter 1 overflow Timer/Event Counter 2 overflow A/D converter interrupt Touch Key interrupt Priority 1 2 3 4 5 6 Vector 04H 08H 0CH 10H 14H 18H configuration options. For most crystal oscillator configurations, the simple connection of a crystal across OSC1 and OSC2 will create the necessary phase shift and feedback for oscillation, without requiring external capacitors. However, if a resonator instead of crystal is connected between OSC1 and OSC2, to ensure oscillation, it may be necessary to add two small value capacitors, C1 and C2. Using a ceramic resonator will usually require two small value capacitors, C1 and C2, to be connected for oscillation to occur. The values of C1 and C2 should be selected in consultation with the crystal or resonator manufacturers specification.
OSC1 Rp Rf C i1 C i2 OSC2 T o in te r n a l c ir c u its H o lte k M C U
Once the interrupt request flags (TKF, ADF, T2F, T1F, T0F and EIF) are all set, they remain in the INTC1 or INTC0 respectively until the interrupts are serviced or cleared by a software instruction. It is recommended that a program should not use the CALL subroutine within the interrupt subroutine. Its because interrupts often occur in an unpredictable manner or require to be serviced immediately in some applications. During that period, if only one stack is left, and enabling the interrupt is not well controlled, operation of the call in the interrupt subroutine may damage the original control sequence. Interrupts for Touch Key interrupt The Touch Key interrupt is initialised by setting the Touch Key interrupt request flag, TKF, bit 6 of INTC1. This is caused by a signal completion of the Touch Key sensor. After the interrupt is enabled, and the stack is not full, and the TKF bit is set, a subroutine call to location 18H occurs. The related interrupt request flag, TKF, will be reset and the EMI bit is cleared to disable further maskable interrupts.
N o te : 1 . R p is n o r m a lly n o t r e q u ir e d . 2 . A lth o u g h n o t s h o w n O S C 1 /O S C 2 p in s h a v e a p a r a s itic c a p a c ita n c e o f a r o u n d 7 p F .
External Crystal/Ceramic Oscillator External RC Oscillator - ERC Using the ERC oscillator only requires that a resistor, with a value between 24kW and 1.5MW, is connected between OSC1 and VDD, and a capacitor is connected between OSC1 and ground, providing a low cost oscillator configuration. It is only the external resistor that determines the oscillation frequency; the external capacitor has no influence over the frequency and is connected for stability purposes only. Device trimming during the manufacturing process and the inclusion of internal frequency compensation circuits are used to ensure that the influence of the power supply voltage, temperature and process variations on the oscillation frequency are minimised. As a resistance/frequency reference point, it can be noted that with an external 120kW resistor connected and with a 5V voltage power supply and temperature of 25C degrees, the oscillator will have a frequency of 4MHz within a tolerance of 2%. Here only the OSC1 pin is used, which is shared with I/O pin PA6, leaving pin PA5 free for use as a normal I/O pin.
V R
OSC DD
Oscillator Configuration
The device provides three system oscillator circuits known as a crystal oscillator (HXT), an external RC oscillator (ERC) and an internal high speed RC oscillator (HIRC) which are used for the system clock. There are also an internal 12kHz RC (LIRC) and a 32.768kHz crystal oscillator (LXT) which can provide a source clock for the WDT clock named fS, the LCD driver clock named fSUB and the Timer/Event counters low frequency clock named fL for various timing purposes. In the Power down mode, the system oscillator, the internal 12kHz RC oscillator (LIRC) or the external 32.768kHz crystal oscillator (LXT) may be enabled or disabled depending upon the corresponding clock control bit described in the relevant sections. The system can be woken-up from the Power down mode by the occurrence of an interrupt, a transition determined by configuration options on any of the Port A pins, a WDT overflow or a timer overflow. External Crystal/ Ceramic Oscillator - HXT The External Crystal/Ceramic System Oscillator is one of the system oscillator choices, which is selected via Rev. 1.10 13
OSC1 470pF
PA5
External RC Oscillator - ERC
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Internal RC Oscillator - HIRC The internal RC oscillator is a fully integrated system oscillator requiring no external components. The internal RC oscillator has three fixed frequencies of either 4MHz, 8MHz or 12MHz. Device trimming during the manufacturing process and the inclusion of internal frequency compensation circuits are used to ensure that the influence of the power supply voltage, temperature and process variations on the oscillation frequency are minimised. As a result, at a power supply of either 3V or 5V and at a temperature of 25C degrees, the fixed oscillation frequency of 4MHz, 8MHz or 12MHz will have a tolerance within 2%. Note that if this internal system clock option is selected, as it requires no external pins for its operation, I/O pins PA5 and PA6 are free for use as normal I/O pins. External 32.768kHz Crystal Oscillator - LXT The External 32.768kHz Crystal Oscillator is one of the low frequency oscillator choices, which is selected via a configuration option. This clock source has a fixed frequency of 32.768kHz and requires a 32.768kHz crystal to be connected between pins OSC3 and OSC4. The external resistor and capacitor components connected to the 32.768kHz crystal are necessary to provide oscillation. For applications where precise frequencies are essential, these components may be required to provide frequency compensation due to different crystal manufacturing tolerances. During power-up there is a time delay associated with the LXT oscillator waiting for it to start-up.
C1 32768H z Rp OSC3 H o lte k M C U
turers specification. The external parallel feedback resistor, Rp, is required. LXT Oscillator C1 and C2 Values Crystal Frequency 32768Hz C1 8pF C2 10pF
Note: 1. C1 and C2 values are for guidance only. 2. RP=5M~10MW is recommended. 32.768kHz Crystal Recommended Capacitor Values LXT Oscillator Low Power Function The LXT oscillator can function in one of two modes, the Quick Start Mode and the Low Power Mode. The mode selection is executed using the QOSC bit in the CTRL0 register. QOSC Bit 0 1 LXT Mode Quick Start Low-power
After power on the QOSC bit will be automatically cleared to zero ensuring that the LXT oscillator is in the Quick Start operating mode. In the Quick Start Mode the LXT oscillator will power up and stabilise quickly. However, after the LXT oscillator has fully powered up it can be placed into the Low-power mode by setting the QOSC bit high. The oscillator will continue to run but with reduced current consumption, as the higher current consumption is only required during the LXT oscillator start-up. In power sensitive applications, such as battery applications, where power consumption must be kept to a minimum, it is therefore recommended that the application program sets the QOSC bit high about 2 seconds after power-on. It should be noted that, no matter what condition the QOSC bit is set to, the LXT oscillator will always function normally; the only difference is that it will take more time to start up if in the Low-power mode. Internal 12kHz Oscillator - LIRC The Internal 12kHz RC Oscillator is one of the low frequency oscillator choices, which is selected via configuration option. It is a fully integrated RC oscillator with a typical period of approximately 65gs at 5V, requiring no external components for its implementation. If the system enters the Power Down Mode, the internal RC oscillator can still continue to run if its clock is necessary to be used to clock the functions for timing purpose such as the WDT function, LCD Driver or Timer/Event Counters. The internal RC oscillator can be disabled only when it is not used as the clock source for all the peripheral functions determined by the configuration options of the WDT function and the relevant control bits which determine the clock is enabled or disabled for related peripheral functions. 14 April 19, 2010
C2 N o te : 1 . R 2.R 3.A p TC OS p,C 1 a lth o u g h a r a s itic
OSC4 C : w ith o u t b u n d C 2 a re re notshow n p c a p a c ita n c e ild - in q u ir e in s h ofar
T o in te r n a l c ir c u its RC d. ave a ound 7pF.
External 32.768kHz Oscillator - LXT When the microcontroller enters the Power down Mode, the system clock is switched off to stop microcontroller activity and to conserve power. However, in many microcontroller applications it may be necessary to keep the internal timers operational even when the microcontroller is in the Power down Mode. To do this, another clock, independent of the system clock, must be provided. The exact values of C1 and C2 should be selected in consultation with the crystal or resonator manufac-
Rev. 1.10
HT46R73D-3
Watchdog Timer - WDT The WDT is implemented using an internal 12kHz RC oscillator known as LIRC, an external 32.768kHz crystal oscillator or the instruction clock which is the system clock divided by 4. The timer is designed to prevent a software malfunction or sequence from jumping to an unknown location with unpredictable results. The watchdog timer can be disabled by a configuration option. If the watchdog timer is disabled, the WDT timer will have the same manner as in the enable-mode except that the timeout signal will not generate a chip reset. So in the watchdog timer disable mode, the WDT timer counter can be read out and can be cleared. This function is used for the application program to access the WDT frequency to get the temperature coefficient for analog component adjustment. The LIRC oscillator can be disabled or enabled by the oscillator enable control bits WDTOSC1 and WDTOSC0 in the WDT control register WDTC for power saving reasons. There are 2 registers related to the WDT function named WDTC and WDTD. The WDTC register can control the WDT oscillator enable/disable and the WDT power source. The WDTD register is the WDT counter content register and this register is read only. The WDT power source selection bits named WDTPWR1 and WDTPWR0 can be used to choose the WDT power source, the WDT default power source is from VOCHP. The main purpose of the regulator is to be used for the WDT Temperature-coefficient adjustment. In this case, the application program should enable the regulator before switching to the Regulator source. The WDTOSC1 and WDTOSC0 bits can be used to enable or disable the LIRC oscillator (12kHz). If the application does not use the LIRC oscillator, then it needs to disable it in order to save power. When the LIRC oscillator is disabled, then it is actually turned off, regardless of the setting of the relevant control bits which select the LIRC oscillator as its clock source. When the LIRC oscillator is enabled, it can be used as the clock source in the Power Down mode defined by the corresponding control bits of the peripheral functions. Once the internal 12kHz RC oscillator LIRC with period 65ms normally is selected, it is divided by max. 215 to get the time-out period of approximately 2.15s. This time-out period may vary with temperature, VDD and process variations. The WDT clock source may also come from the instruction clock, in which case the WDT will operate in the same manner except that in the Power Down mode the WDT may stop counting and lose its protecting purpose. In this situation the device can only be restarted by external logic. If the device operates in a noisy environment, using the on-chip LIRC oscillator is strongly recommended, since the HALT instruction will stop the system clock. The WDT overflow under normal operation initializes a chip reset and sets the status bit TO. In the Power Down Mode, the overflow initializes a warm reset, and only the PC and SP are reset to zero. There are three methods to clear the contents of the WDT, an external reset (a low level on RES), a software instruction or a HALT instruction. There are two types of software instructions; the single CLR WDT instruction, or the pair of instructions - CLR WDT1 and CLR WDT2. Of these two types of instruction, only one type of instruction can be active at a time depending on the configuration option - CLR WDT times selection option. If the CLR WDT is selected (i.e., CLR WDT times equal one), any execution of the CLR WDT instruction clears the WDT. If the CLR WDT1 and CLR WDT2 option is chosen (i.e., CLR WDT times equal two), these two instructions have to be executed to clear the WDT, otherwise the WDT may reset the chip due to a time-out.
VOCHP VOREG
W DT PW R L IR C OSC LXT OSC
C L R W D T 1 F la g C L R W D T 2 F la g 1 /2 In s tr u c tio n s fL fL
IR C
C o n tro l L o g ic W D T S o u rc e C o n fig u r a tio n O p tio n fS
1
L IR C
OSC E n a b le
fS
YS
/4
CLR 1 5 - B it C o u n te r W D T D iv W S2~W 2 8/fS , 2 11/fS , 2 14 is io n W DT S0 E N /D IS 2 9/fS , 2 10/fS , 2 12/fS , 2 13/fS , /fS , 2 15/fS
LXT O SC E n a b le
XT
W DT T im e - o u t
b4~b11
D a ta B u s
Watchdog Timer
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Bit No. Label Function
0 1
The WDT Power source selection. 01: WDT power comes from VOCHP WDTPWR0~ 10: WDT power comes from Regulator WDTPWR1 00/11: WDT power comes from VOCHP It is strongly recommend to use 01 for VOCHP to prevent the noise to let the WDT lose the power The LIRC oscillator enable/disable control bits 01: LIRC oscillator is disabled 10: LIRC oscillator is enabled 00/11: LIRC oscillator is enabled It is strongly recommended to use 10 for WDT OSC enable Reserved WS2~WS0: WDT prescaler rate select WS2 0 0 WS1 0 0 1 1 0 0 1 1 WS0 0 1 0 1 0 1 0 1 WDT Rate 28/fS 29/fS 210/fS 211/fS 212/fS 213/fS 214/fS 215/fS
2 3
WDTOSC0~ WDTOSC1
4
3/4
5 6 7
WS0 WS1 WS2
0 0 1 1 1 1
WDTC (1CH) Register Note: The initial value of the WDTOSC1 and WDTOSC0 bits will be set to 10 to enable the LIRC oscillator if both the WDT function is enabled and the WDT clock is selected from the LIRC oscillator determined by the configuration options. Otherwise, the initial value of these two bits will be set to 01. The WDT clock (fS) is further divided by an internal counter to give longer watchdog time-out period. In this device, the division ratio can be varied by selecting different values of WS2~WS0bits to give 28/fS to 215/fS division ratio range.
Bit No. 0~7
Label WDTD0~ WDTD7
Function The WDT Counter value (bit4 ~ bit11) This register is read only and used for temperature adjusting. WDTD (1DH) Register
The WDT clock (fS1) is further divided by an internal counter to give longer watchdog time-outs., In this device, the division ratio can be varied by selecting different configuration options to give 213 to 216 division ration range.
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Buzzer Output The Buzzer function provides a means of producing a variable frequency output, suitable for applications such as Piezo-buzzer driving or other external circuits that require a precise frequency generator. The BZ and BZ pins form a complimentary pair, and are pin-shared with I/O pins, PA1 and PA2. Configuration options are used to select from one of three buzzer options. The first option is for both pins PA1 and PA2 to be used as normal I/Os, the second option is for both pins to be configured as BZ and BZ buzzer pins, the third option selects only the PA1 pin to be used as a BZ buzzer pin with the PA2 pin retaining its normal I/O pin function. Note that the BZ pin is the inverse of the BZ pin which together generates a differential output which can supply more power to connected interfaces such as buzzers. The buzzer is driven by the Timer/Event Counter 0 or Timer/Event Counter 1 overflow signal divided by 2 selected by the clock source selection bit named BZCS in CTRL1 register. If the configuration options have selected both pins PA1 and PA2 to function as a BZ and BZ complementary pair of buzzer outputs, then for correct buzzer operation it is essential that both pins must be setup as outputs by setting bits PAC1 and PAC2 of the PAC port control register to zero. The PA1 data bit in the PA data register must also be set high to enable the buzzer outputs, if set low, both pins PA1 and PA2 will remain low. In this way the single bit PA1 of the PA data register can be used as an on/off control for both the BZ and BZ buzzer pin outputs. Note that the PA2 data bit in the PA data register has no control over the BZ buzzer pin PA2. If configuration options have selected that only the PA1 pin is to function as a BZ buzzer pin, then the PA2 pin can be used as a normal I/O pin. For the PA1 pin to function as a BZ buzzer pin, PA1 must be setup as an output by setting bit PAC1 of the PAC port control register to zero. The PA1 data bit in the PA data register must also be set high to enable the buzzer output, if set low pin PA1 will remain low. In this way the PA1 bit can be used as an on/off control for the BZ buzzer pin PA1. If the PAC1 bit of the PAC port control register is set high, then pin PA1 can still be used as an input even though the configuration option has configured it as a BZ buzzer output.
T im e r O v e r flo w B u z z e r C lo c k
P A 1 D a ta P A 2 D a ta B Z O u tp u t a t P A 1
B Z O u tp u t a t P A 2
Buzzer Output Pin Control
PAC Register PAC1 0 0 0 0 1 1 1
PAC Register PAC2 0 0 1 1 0 0 1
PA Data Register PA1 0 1 0 1 1 0 X
PA Data Register PA2 X X X X X X X
Output Function PA1=0, PA2=0 PA1=BZ, PA2=BZ PA1=0, PA2=Input Line PA1=BZ, PA2=Input Line PA1=Input Line, PA2=BZ PA1=Input Line, PA2=0 PA1=Input Line, PA2=Input Line
X stands for dont care PA1/PA2 Pin Function Control Rev. 1.10 17 April 19, 2010
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Note that no matter what configuration option is chosen for the buzzer, if the port control register has setup the pin to function as an input, then this will override the configuration option selection and force the pin to always behave as an input pin. This arrangement enables the pin to be used as both a buzzer pin and as an input pin, so regardless of the configuration option chosen; the actual function of the pin can be changed dynamically by the application program by programming the appropriate port control register bit. Note: The above drawing shows the situation where both pins PA1 and PA2 are selected by configuration option to be BZ and BZ buzzer pin outputs. The Port Control Register of both pins must have already been setup as outputs. The data setup on pin PA2 has no effect on the buzzer outputs. causes device initialisation, and the WDT overflow performs a warm reset. After examining the TO and PDF flags, the reason for chip reset can be determined. The PDF flag is cleared by system power-up or by executing the CLR WDT instruction, and is set by executing the HALT instruction. On the other hand, the TO flag is set if WDT time-out occurs, and causes a wake-up that only resets the program counter and SP, and leaves the others in their original state. The port A wake-up and interrupt methods can be considered as a continuation of normal execution. Each pin of port A can be independently selected to wake-up the device using configuration options. After awakening from an I/O port stimulus, the program will resume execution at the next instruction. However, if awakening from an interrupt, two sequences may occur. If the related interrupt is disabled or the interrupt is enabled but the stack is full, the program will resume execution at the next instruction. But if the interrupt is enabled, and the stack is not full, the regular interrupt response takes place. When an interrupt request flag is set before entering the HALT status, the system cannot be awakened using that interrupt. If a wake-up events occur, it takes 1024 tSYS (system clock periods) to resume normal operation. In other words, a dummy period is inserted after the wake-up. If the wake-up results from an interrupt acknowledgment, the actual interrupt subroutine execution is delayed by more than one cycle. However, if the wake-up results in the next instruction execution, the execution will be performed immediately after the dummy period is finished. To minimize power consumption, all the I/O pins should be carefully managed before entering the HALT status.
Power Down Operation - HALT
The Power down mode is initialised by the HALT instruction and results in the following.
* The system oscillator stops running if the system os-
cillator is selected to be turned off by clearing the OSCON bit in the HALTC register to zero. Otherwise, the system oscillator will keep running if it is selected to be turned on in the power down mode.
* The contents of the on-chip Data Memory and of the
registers remain unchanged.
* The WDT is cleared and starts recounting (if the WDT
clock source is from the LIRC or the LXT oscillator).
* All I/O ports maintain their original status. * The PDF flag is set but the TO flag is cleared. * The LCD driver keeps running if the LCD clock fSUB is
enabled by setting the FSUBC bit to 1 and the LCDON bit in the HALTC register is set to 1. The system leaves the Power down mode by means of an external reset, an interrupt, an external transition signal on Port A, or a WDT overflow. An external reset
Bit No.
Label
Function LCD module state in Power down mode 1: LCD module remains on (if fSUB is active) regardless of the configuration option setting 0: LCD state is determined by the LCD_ON configuration option Reserved, read as 0 System oscillator state in Power down mode 1: System oscillator keeps running in Power down mode 0: System oscillator stops running in Power down mode HALTC Register
0
LCDON
1~6 7
1/2 OSCON
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Reset
There are three ways in which a reset may occur.
* RES is reset during normal operation * RES is reset during HALT * WDT time-out is reset during normal operation
The WDT time-out during Power Down Mode differs from other chip reset conditions, for it can perform a warm reset that resets only the program counter and SP and leaves the other circuits at their original state. Some registers remain unaffected during any other reset conditions. Most registers are reset to their initial conditions once the reset conditions are met. By examining the PDF and TO flags, the program can distinguish between different chip resets. TO 0 u 0 1 1 PDF 0 u 1 u 1 RESET Conditions RES reset during power-up RES reset during normal operation RES Wake-up HALT WDT time-out during normal operation WDT Wake-up HALT
To guarantee that the system oscillator is started and stabilized, the SST (System Start-up Timer) provides an extra-delay of 1024 system clock pulses when the system awakes from the HALT state or during power-up. Awaking from the HALT state or system power-up, the SST delay is added. An extra SST delay is added during the power-up period, and any wake-up from HALT may enable only the SST delay. The functional unit chip reset status is shown below. Program Counter Interrupt Prescaler, Divider WDT Timer/Event Counter Input/output Ports Stack Pointer 000H Disabled Cleared Cleared. After master reset, WDT starts counting Off Input mode Points to the top of the stack
Note: u stands for unchanged
VDD RES S S T T im e - o u t C h ip R eset tS
ST
HALT W DT E x te rn a l
W a rm
R eset
RES
Reset Timing Chart
OSC1
SST 1 0 - b it R ip p le C o u n te r S y s te m R eset
C o ld R eset
V
DD
V
DD
0 .0 1 m F 100kW RES 0 .1 m F 100kW RES 10kW 0 .1 m F
Reset Configuration
B a s ic Reset C ir c u it
H i-n o is e Reset C ir c u it
Reset Circuit Note: Most applications can use the Basic Reset Circuit as shown, however for applications with extensive noise, it is recommended to use the Hi-noise Reset Circuit.
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The register states are summarized below: Register MP0 MP1 BP ACC Program Counter TBLP TBLH CTRL0 CTRL1 STATUS INTC0 INTC1 TMR0 TMR0C TMR1H TMR1L TMR1C TMR2H TMR2L TMR2C PA PAC PB PBC CHPRC WDTC WDTD ADCR ADCD VIBRC LCDOUT CFCR0 CFCR1 ANCS0 HALTC Reset (Power On) xxxx xxxx xxxx xxxx ---- ---0 xxxx xxxx 0000H xxxx xxxx -xxx xxxx 0000 0000 ---- --01 --00 xxxx -000 0000 -000 -000 xxxx xxxx 0000 1000 xxxx xxxx xxxx xxxx 0000 1000 xxxx xxxx xxxx xxxx 0000 1000 1111 1111 1111 1111 1111 1111 1111 1111 0000 0000 111- ss01 0000 0000 -000 x000 0--0 0111 ---- ---0 ---- 0000 0000 0000 ---- -000 ---- 0000 0--- ---0 WDT Time-out RES Reset (Normal Operation) (Normal Operation) uuuu uuuu uuuu uuuu ---- ---0 uuuu uuuu 0000H uuuu uuuu -uuu uuuu 0000 0000 ---- --01 --1u uuuu -000 0000 -000 -000 xxxx xxxx 0000 1000 xxxx xxxx xxxx xxxx 0000 1000 xxxx xxxx xxxx xxxx 0000 1000 1111 1111 1111 1111 1111 1111 1111 1111 0000 0000 111- ss01 0000 0000 -000 x000 0--0 0111 ---- ---0 ---- 0000 0000 0000 ---- -000 ---- 0000 0--- ---0 uuuu uuuu uuuu uuuu ---- ---0 uuuu uuuu 0000H uuuu uuuu -uuu uuuu 0000 0000 ---- --01 --uu uuuu -000 0000 -000 -000 xxxx xxxx 0000 1000 xxxx xxxx xxxx xxxx 0000 1000 xxxx xxxx xxxx xxxx 0000 1000 1111 1111 1111 1111 1111 1111 1111 1111 0000 0000 111- ss01 0000 0000 -000 x000 0--0 0111 ---- ---0 ---- 0000 0000 0000 ---- -000 ---- 0000 0--- ---0 RES Reset (HALT) uuuu uuuuuuuu uuuu uuuu ---- ---0 uuuu uuuu 0000H uuuu uuuu -uuu uuuu 0000 0000 ---- --01 --01 uuuu -000 0000 -000 -000 xxxx xxxx 0000 1000 xxxx xxxx xxxx xxxx 0000 1000 xxxx xxxx xxxx xxxx 0000 1000 1111 1111 1111 1111 1111 1111 1111 1111 0000 0000 111- ss01 0000 0000 -000 x000 0--0 0111 ---- ---0 ---- 0000 0000 0000 ---- -000 ---- 0000 0--- ---0 WDT Time-out (HALT)* uuuu uuuu uuuu uuuu ---- ---u uuuu uuuu 0000H uuuu uuuu -uuu uuuu uuuu uuuu ---- --uu --11 uuuu -uuu uuuu -uuu -uuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuu- uuuu 0000 0000 -uuu xuuu u--u uuuu ---- ---u ---- uuuu uuuu uuuu ---- -uuu ---- uuuu u--- ---u
Note: * stands for warm reset u stands for unchanged x stands for unknown
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HT46R73D-3
Timer/Event Counter
Three timer/event counters are implemented in the microcontroller. Timer/Event Counter 0 contains an 8-bit programmable count-up counter whose clock may come from an external source or an internal clock source. An internal clock source comes from fSYS or the Internal low frequency clock known as fL. Timer/Event Counter 1 contains a 16-bit programmable count-up counter whose clock may come from an external source or an internal clock source. An internal clock source comes from fSYS/4 or the Internal low frequency clock known as fL. The clock fL is derived from the LIRC or LXT oscillator and can be selected by the Low Frequency selection bit LFS bit in the CTRL0 register. The external clock input allows the user to count external events, measure time intervals or pulse widths, or to generate an accurate time base. Timer/Event Counter 2 contains a 16-bit programmable count-up counter whose clock may come from an external source or an internal clock source. An internal clock source comes from fSYS/4 or the Timer/Event Counter 2 internal clock fTCK. The clock fTCK may come from the low frequency clock fL or the clocks generated from the Touch Key module named fREF, fSEN and fTMCK described in the Touch Key Function section. The clock is selected using the Timer/Event Counter 2 clock source selection bits TCKS1 and TCK0 in the CTRL0 register. The external clock input allows the user to count external events, measure time intervals or pulse widths, or to generate an accurate time base. There are two registers related to the Timer/Event Counter 0; TMR0 and TMR0C. Writing to TMR0 puts the starting value in the Timer/Event Counter 0 register and reading TMR0 reads out the contents of Timer/Event Counter 0. The TMR0C is a timer/event counter control register, which defines the overall operations. There are three registers related to the Timer/Event Counter 1; TMR1H, TMR1L and TMR1C. Writing to TMR1L will only put the written data into an internal lower-order byte buffer (8-bit) while writing to TMR1H will transfer the specified data and the contents of the lower-order byte buffer to both the TMR1H and TMR1L registers, respectively. The Timer/Event Counter 1 preload register is changed when each time there is a write operation to TMR1H. Reading TMR1H will latch the contents of TMR1H and TMR1L counters to the destination and the lower-order byte buffer, respectively. Reading TMR1L will read the contents of the lower-order byte buffer. TMR1C is the Timer/Event Counter 1 control register, which defines the operating mode, counting enable or disable, the TMR1 active edge and the prescaler stage selections. Also there are three registers related to the Timer/Event Counter 2 named TMR2H, TMR2L and TMR2C. The operations of reading from and writing to the Timer/Event Counter 2 registers named TMR2H and TMR2L are the same with Timer/Event Counter 1 described above.
L IR C (1 2 k H z ) M L X T (3 2 .7 6 8 k H z )
fS U X
YS
fL
M U
fT
0
X
8 - s ta g e P r e s c a le r 8 -1 M U X T0PSC 2~T0PSC 0 TM R0 T0M 1 T0M 0 T0O N T0E P u ls e W id th M e a s u re m e n t M o d e C o n tro l 8 - b it T im e r /E v e n t C o u n te r (T M R 0 ) 1 /2 O v e r flo w to In te rru p t BZ0 f IN
T0
T0S
D a ta B u s T0M 1 T0M 0 8 - b it T im e r /E v e n t C o u n te r P r e lo a d R e g is te r R e lo a d
LFS
Timer/Event Counter 0
L IR C (1 2 k H z ) M L X T (3 2 .7 6 8 k H z )
fS U X
YS
fL
/4
M U
fT
1
D a ta B u s 8 - s ta g e P r e s c a le r 8 -1 M U X T1PSC 2~T1PSC 0 TM R1 T1M 1 T1M 0 T1O N T1E P u ls e W id th M e a s u re m e n t M o d e C o n tro l f IN
T1
X
LFS
T1S
L o w B y te B u ffe r T1M 1 T1M 0 1 6 - b it T im e r /E v e n t C o u n te r P r e lo a d R e g is te r R e lo a d
H ig h B y te
Low
B y te 1 /2
1 6 - B it T im e r /E v e n t C o u n te r
O v e r flo w to In te rru p t BZ1
Timer/Event Counter 1
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HT46R73D-3
L IR C (1 2 k H z ) M U X fL fR fS fT
EF EN
L X T (3 2 .7 6 8 k H z )
M U
fS X
YS
/4 M
CK
LFS
fT
U X
fT
2
8 - s ta g e P r e s c a le r 8 -1 M U X T2PSC 2~T2PSC 0 f IN
T2
D a ta B u s L o w B y te B u ffe r
MCK
T2S T C K S [1 :0 ]
T2M 1 T2M 0 1 6 - b it T im e r /E v e n t C o u n te r P r e lo a d R e g is te r R e lo a d
TM R2 T2M 1 T2M 0 T2O N
T2E P u ls e W id th M e a s u re m e n t M o d e C o n tro l
H ig h B y te
L o w B y te
1 6 - B it T im e r /E v e n t C o u n te r
O v e r flo w to In te rru p t
Timer/Event Counter 2
Bit No.
Label
Function To define the prescaler stages, T0PSC2, T0PSC1, T0PSC0= 000: fINT0=fT0 001: fINT0=fT0/2 010: fINT0=fT0/4 011: fINT0=fT0/8 100: fINT0=fT0/16 101: fINT0=fT0/32 110: fINT0=fT0/64 111: fINT0=fT0/128 Defines the TMR0 active edge of the timer/event counter: In Event Counter Mode (T0M1,T0M0)=(0,1): 1:count on falling edge; 0:count on rising edge In Pulse Width measurement mode (T0M1,T0M0)=(1,1): 1: start counting on the rising edge, stop on the falling edge; 0: start counting on the falling edge, stop on the rising edge Enable/disable timer counting (0=disabled; 1=enabled) Defines the TMR0 internal clock source 0: fSYS 1: Low Frequency clock fL Defines the operating mode T0M1, T0M0= 01: Event count mode (External clock) 10: Timer mode (Internal clock) 11: Pulse Width measurement mode (External clock) 00: Unused TMR0C (0EH) Register
0 1 2
T0PSC0 T0PSC1 T0PSC2
3
T0E
4 5
T0ON T0S
6 7
T0M0 T0M1
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Bit No. Label Function To define the prescaler stages, T1PSC2, T1PSC1, T1PSC0= 000: fINT1=fT1 001: fINT1=fT1/2 010: fINT1=fT1/4 011: fINT1=fT1/8 100: fINT1=fT1/16 101: fINT1=fT1/32 110: fINT1=fT1/64 111: fINT1=fT1/128 Defines the TMR1 active edge of the timer/event counter: In Event Counter Mode (T1M1,T1M0)=(0,1): 1: count on falling edge; 0: count on rising edge In Pulse Width measurement mode (T1M1,T1M0)=(1,1): 1: start counting on the rising edge, stop on the falling edge; 0: start counting on the falling edge, stop on the rising edge Enable/disable timer counting (0=disabled; 1=enabled) Defines the TMR1 internal clock source 0: fSYS/4 1: Low Frequency clock fL Defines the operating mode T1M1, T1M0= 01: Event count mode (External clock) 10: Timer mode (Internal clock) 11: Pulse Width measurement mode (External clock) 00: Unused TMR1C (11H) Register Bit No. Label Function To define the prescaler stages, T2PSC2, T2PSC1, T2PSC0= 000: fINT2=fT2 001: fINT2=fT2/2 010: fINT2=fT2/4 011: fINT2=fT2/8 100: fINT2=fT2/16 101: fINT2=fT2/32 110: fINT2=fT2/64 111: fINT2=fT2/128 Defines the TMR2 active edge of the timer/event counter: In Event Counter Mode (T2M1,T2M0)=(0,1): 1: count on falling edge; 0: count on rising edge In Pulse Width measurement mode (T2M1,T2M0)=(1,1): 1: start counting on the rising edge, stop on the falling edge; 0: start counting on the falling edge, stop on the rising edge Enable/disable timer counting (0=disabled; 1=enabled) Defines the TMR2 internal clock source 0: fSYS/4 1: fTCK Defines the operating mode T2M1, T2M0= 01: Event count mode (External clock) 10: Timer mode (Internal clock) 11: Pulse Width measurement mode (External clock) 00: Unused TMR2C Register
0 1 2
T1PSC0 T1PSC1 T1PSC2
3
T1E
4 5
T1ON T1S
6 7
T1M0 T1M1
0 1 2
T2PSC0 T2PSC1 T2PSC2
3
T2E
4 5
T2ON T2S
6 7
T2M0 T2M1
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The TxM0 and TxM1 bits in TMRxC register where x may be equal to 0, 1 or 2 define the operation mode. The event count mode is used to count external events, which means that the clock source must come from the external (TMR0, TMR1 or TMR2) pin. The timer mode functions as a normal timer with the clock source coming from the internal selected clock source. Finally, the pulse width measurement mode can be used to count a high or low level duration of an external signal on the TMR0, TMR1 or TMR2 pins with the timing based on the internally selected clock source. In the event count or timer mode, the Timer/Event Counter starts counting at the current contents in the Timer/Event Counter and ends at FFH for -8-bit counter or FFFFH for 16-bit counter. Once an overflow occurs, the counter is reloaded from the timer/event counter preload register, and generates an interrupt request flag, T0F, T1F or T2F. In the pulse width measurement mode with the values of the Timer enable control bit TxON and the active edge control bit TxE equal to 1, after the TMRx pin has received a transient from low to high (or high to low if the TxE bit is 0), it will start counting until the TMRx pin returns to the original level and resets the TxON bit. The measured result remains in the timer/event counter even if the activated transient occurs again. Therefore, only a 1-cycle measurement can be made until the TxON bit is again set. The cycle measurement will re-function as long as it receives further transient pulses. In this operation mode, the timer/event counter begins counting not according to the logic level but to the transient edges. In the case of counter overflows, the counter is reloaded from the timer/event counter register and issues an interrupt request, as in the other two modes, i.e., event and timer modes. To enable the counting operation, the Timer enable bit known as TxON in TMRxC where x indicates 0, 1 or 2 should be set to 1. In the pulse width measurement mode, the TxON is automatically cleared after the measurement cycle is completed. But in the other two modes, the TxON bit can only be reset by instructions. The overflow of the Timer/Event Counters is one of the wake-up sources. No matter what the operation mode is, writing a 0 to the related Timer/Event counter interrupt enable control bit ETxI disables the related interrupt service. In the case of a Timer/Event Counter OFF condition, writing data to the timer/event counter preload register also reloads that data to the timer/event counter. But if the timer/event counter is turned on, data written to the timer/event counter is kept only in the timer/event counter preload register. The timer/event counter still continues its operation until an overflow occurs. When the Timer/Event Counter Register TMRx or TMRxH/TMRxL is read, the clock is blocked to avoid errors, however as this may result in a counting error, it should be taken into account by the programmer. It is strongly recommended to load a desired value into the Timer/Event Counter Register TMRx or TMRxH/TMRxL first, before turning on the related timer/event counter, for proper operation since the initial value of TMRx or TMRxH/TMRxL is unknown. Due to the Timer/Event Counter scheme, the programmer should pay special attention to the instructions which enables then disables the timer for the first time, whenever there is a need to use the timer/event counter function, to avoid unpredictable results. After this procedure, the timer/event function can be operated normally. The bit0~bit2 of the Timer/Event Counter control register TMRxC can be used to define the pre-scaling stages of the internal clock sources of Timer/Event Counters.
Input/Output Ports
There are maximum 16 bidirectional input/output lines in the microcontroller, labeled as PA, PB and PC. All of these I/O ports can be used for input and output operations. For input operation, these ports are non-latching, that is, the inputs must be ready at the T2 rising edge of instruction MOV A, [m]. For output operation, all the data is latched and remains unchanged until the output latch is rewritten. Each I/O line has its own control register, PAC, PBC and PCC, to control the input/output configuration. With this control register, CMOS outputs or Schmitt trigger inputs with or without pull-high resistor structures can be reconfigured dynamically under software control. To function as an input, the corresponding latch of the control register must write 1. The input source also depends on the control register. If the control register bit is 1, the input will read the pad state. If the control register bit is 0, the contents of the latches will move to the internal bus. The latter is possible in the read-modify-write instruction. For output function, CMOS is the only configuration. These control registers are mapped to locations 13H, and 15H. After a chip reset, these input/output lines remain at high levels or in a floating state, depending upon the pull-high configuration options. Each bit of these input/output latches can be set or cleared by SET [m].i and CLR [m].i (m=12H or 14H) instructions. Some instructions first input data and then follow the output operations. For example, SET [m].i, CLR [m].i, CPL [m], CPLA [m] read the entire port states into the CPU, execute the defined operations (bit-operation), and then write the results back to the latches or the accumulator. Each line of port A has the capability of waking-up the device.
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HT46R73D-3
V C o n tr o l B it Q D CK S Q P u ll- H ig h O p tio n
DD
D a ta B u s W r ite C o n tr o l R e g is te r C h ip R e s e t R e a d C o n tr o l R e g is te r
D a ta B it Q D CK S Q M U X
PA0 PA1 PA2 PA3 PA4 PA5 PA6 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7
/V IB /B Z /B Z /O S /O S /O S /O S /T K /T K /T K /T K /S E /S E /S E /S E 1 2 3 0
/K C C C C 4 3 2 1
REF
W r ite D a ta R e g is te r
PA1,PA2 BZ,BZ M U X R e a d D a ta R e g is te r S y s te m W a k e -u p ( P A o n ly )
EN
G0 G1 G2 G3
/IN /T /T /T
T MR0 MR1 MR2
C o n fig u r a tio n O p tio n s
T M R 0 , T M R 1 , T M R 2 , IN T
Input/Output Ports
D a ta B u s W r ite C o n tr o l R e g is te r C h ip R e s e t R e a d C o n tr o l R e g is te r
C o n tr o l B it Q D CK S Q
P A 7 /R E S D a ta B it Q D
W r ite D a ta R e g is te r
CK S
Q
M U
R e a d D a ta R e g is te r S y s te m W a k e -u p (P A 7 ) R E S fo r P A 7 o n ly
X
PAW K7
PA7 Pin
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HT46R73D-3
Each pin of these two I/O ports except PA7 pin has a pull-high resistor determined by a configuration option. Once the pull-high configuration option is selected, the I/O pin has a pull-high resistor connected. Take note that a non-pull-high I/O pin setup as an input will be in a floating condition. PA1 and PA2 are pin-shared with BZ and BZ signal, respectively. If the BZ/BZ configuration option is selected, the output signals in the output mode of PA1/PA2 can be the buzzer signal. The input mode always retains its original function. Once the BZ/BZ configuration option is selected, the buzzer output signals are controlled by the PA1 data register. The PA0/PA2 I/O function is shown below.
PA0 I/O PA2 I/O PA0 Mode PA2 Mode PA0 Data PA2 Data PA0 Pad Status PA2 Pad Status I I X X X X I I I O X C X D I D O I C X D X D I O I B X 0 X 0 I O I B X 1 X B I O O C C D0 D1 D0 D1 O O B C 0 D 0 D O O B C 1 D B D O O B B 0 X 0 0 O O B B 1 X B B I O B B 0 X I 0 I O B B 1 C I B
voltage for other applications. The user needs to guarantee the charge pump output voltage is greater than 3.6V to ensure that the regulator generates the required 3.3V voltage output. The block diagram of this module is shown below.
CHPC2 CHPC1 VOCHP VOREG
VDD
C h a rg e P u m p ( V o lta g e D o u b le r )
VDD V D D x2
R e g u la to r (3 .3 V )
3 .3 V
W DT ADC
fS
D iv id e r CHPCKD CHPEN
REGCEN
Additionally, the device also includes a band gap voltage generator for the 1.5V low temperature sensitive reference voltage. This reference voltage is used as the zero adjustment and for a single end type reference voltage.
R e g u la to r R EF
I
Band G ap E nhance
R
F IL
VOBGP C
Note: I input; O output D, D0, D1 Data B buzzer option, BZ or BZ X dont care C CMOS output It is recommended that unused or not bonded out I/O lines should be set as output pins using software instructions to avoid consuming power when in an input floating state.
BG (S 0: 1:
PQST F R b its ) O ff (s h o rt) On
F IL
RFIL is about 100kW and the recommend CFIL is 10mF. Note: VOBGP signal is only for chip internal used. Dont connect to external component except the recommend CFIL There is a single register associated with this module named CHPRC. The CHPRC is the Charge Pump/Regulator Control register, which controls the charge pump on/off, regulator on/off functions as well as setting the clock divider value to generate the clock for the charge pump. The CHPCKD4~CHPCKD0 bits are use to set the clock divider to generate the desired clock frequency for proper charge pump operation. The actual frequency is determined by the following formula. Actual Charge Pump Clock= (fSYS/16)/(CHPCKD +1).
Charge Pump and Voltage Regulator
There is one charge pump and one voltage regulator implement in this device. The charge pump can be enabled/disabled by the application program. The charge pump uses VDD as its input, and has the function of doubling the VDD voltage. The output voltage of the charge pump will be VDD2. The regulator can generate a stable voltage of 3.3V, for internal WDT, ADC and also can provide an external bridge sensor excitation voltage or supply a reference
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HT46R73D-3
Bit No. 0 1 Label REGCEN CHPEN Function Enable/disable Regulator/Charge-Pump module. (1=enable; 0=disable) Charge Pump Enable/disable setting. (1=enable; 0=disable) Note: this bit will be ignore if the REGCEN is disable Band gap quickly start-up function 0: R short, quickly start 1: R connected, normal RC filter mode Every time when REGCEN change from 0 to 1 (Regulator turn on) This bit should be set to 0 and then set to 1 to make sure the quickly stable. (the minimum 0 keeping time is about 2ms now )
2
BGPQST
3~7
The Charge pump clock divider. This 5 bits can form the clock divide by 1~32. CHPCKD0~ Following the below equation: CHPCKD4 Charge Pump clock = (fSYS/16) / (CHPCKD+1) CHPRC (1FH) Register Charge Pump OFF OFF ON VOCHP Regulator Pin VDD VDD 2VDD OFF ON ON
REGCEN CHPEN 0 1 1 X 0 1
VOREG Pin OPA ADC Hi-Impedance 3.3V 3.3V Disable Active Active
Description The whole module is disable, OPA/ADC will lose the Power Use for VDD is greater than 3.6V (VDD>3.6V) Use for VDD is less than 3.6V (VDD=2.2V~3.6V)
The suggested charge pump clock frequency is 20kHz. The application needs to set the correct value to get the desired clock frequency. For a 4MHz application, the CHPCKD bits should be set to the value 11, and for a 2MHz application, the bits should be set to 5. The REGCEN bit in the CHPRC register is the Regulator/ Charge-pump module enable/disable control bit. If this bit is disabled, then the regulator will be disabled and the charge pump will be also be disabled to save power. When REGCEN = 0, the module will enter the Power Down Mode ignoring the CHPEN setting. The ADC and OPA will also be disabled to reduce power. If REGCEN is set to 1, the regulator will be enabled. If CHPEN is enabled, the charge pump will be active and will use VDD as its input to generate the double voltage output. This double voltage will be used as the input voltage for the regulator. If CHPEN is set to 0, the charge pump is disabled and the charge pump output will be equal to the charge pump input, VDD. It is necessary to take care of the VDD voltage. If the voltage is less than 3.6V, then CHPEN should be set to 1 to enable the charge pump, otherwise CHPEN should be set to zero. If the Charge pump is disabled and VDD is less than 3.6V then the output voltage of the regulator will not be guaranteed.
ADC - Dual Slope A Dual Slope A/D converter is implemented in this microcontroller. The dual slope module includes an Operational Amplifier, a Programmable Gain Amplifier PGA for the amplification of differential signals, an Integrator and a comparator for the main dual slope AD converter. There are 2 special function registers related to this function known as ADCR and ADCD. The ADCR register is the A/D control register, which controls the ADC block power on/off, the chopper clock on/off, the charge/discharge control and is also used to read out the comparator output status. The ADCD register is the A/D Chopper clock divider register, which defines the chopper clock to the ADC module. The ADPWREN bit, defined in ADCR register, is used to control the ADC module on/off function. The ADCCKEN bit defined in the ADCR register is used to control the chopper clock on/off function. When ADCCKEN is set to 1 it will enable the Chopper clock, with the clock frequency defined by the ADCD register. The ADC module includes the OPA, PGA, integrator and comparator. However, the Bandgap voltage generator is independent of this module. It will be automatically enabled when the regulator is enabled, and also be disabled when the regulator is disabled. The application program should enable the related power to permit them to function and disable them when entering the power down mode to conserve power. The charge/discharge control bits,
Rev. 1.10
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HT46R73D-3
VDSO R v f1 V M U X + + In te g ra to r R v f3
IN T
PW R C o n tro l ADPW REN
VOREG
R v f2 V
CMP
DOPAP + DOPAN
A D IS A m p lifie r fro m DCHOP MUX fro m T H /L B
PGA ( G a in = 2 ,4 ) PGAG
ADCMPO C o m p a ra to r
O n C h ip O ff C h ip DOPAO DCHOP DSRR T H /L B ( A D in p u t fo r e x te r n a l th e r m a l/lo w b a tte r y d e te c tio n o r o th e r u s a g e ) d iffe r e n t R DSRC DSCC
A D D IS C H 0 A D D IS C H 1
N o te : V
IN T
,V
CMP
s ig n a l c a n c o m e fr o m
g r o u p s w h ic h a r e s e le c te d b y s o ftw a r e r e g is te r s .
Dual Slope ADC Structure
25kW VOREG DOPAN Chopper A m p lifie r
100kW
27nF
DOPAO
DCHOP PGA
VB
B r id g e S ensor
VA DOPAP O ff C h ip O n C h ip
N o te : A ll " R " a n d " C " v a lu e s h e r e a r e fo r r e fe r e n c e o n ly
Dual Slope ADC with Bridge Sensor input
ADDISCH1 and ADDISCH0, are used to control the Dual slope circuit charging and discharging behavior. The ADCMPO bit is read only for the comparator output, while the ADINTM bits can set the ADCMPO trigger mode for interrupt generation. The ADC PGA input signal can come from the DCHOP or TH/LB pin selected by the ADIS selection bit in ADCD register. The PGA gain can be either 2 or 4 determined by the PGAG gain selection bit in the ADCD register. The reference voltages of the ADC integrator and comparator named VINT and VCMP shown in the Dual Slope ADC structure diagram can be selected by the ADRR0 selection bit. Dual Slope ADC Operation The following descriptions are based on the fact that the ADRR0 bit is set to 0.
C o m p a ra to r 4 /6 V D S O + In te g r a to r DSRR V
A
1 /6 V D S O
ADCMPO
DSRC
DSCC V
C
R
DS
C
DS
The amplifier and buffer combination, form a differential input pre-amplifier which amplifies the sensor input signal. The combination of the Integrator, the comparator, the resistor RDS, between DSRR and DSRC and the capacitor CDS, between DSRC and DSCC form the main body of the Dual slope ADC.
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The Integrator integrates the output voltage increase or decrease and is controlled by the Switch Circuit - refer to the block diagram. The integration and de-integration curves are illustrated by the following. The comparator will switch the state from high to low when VC, which is the DSCC pin voltage,drops to less than 1/6 VDSO. In general applications, the application program will switch the ADC to the charging mode for a fixed time called Ti, which is the integrating time. It will then switch to the dis-charging mode and wait for Vc to drop to less
V
C
than 1/6 VDSO. At this point the comparator will change state and store the time taken, TC, which is the de-integrating time. The following formula 1 can then be used to calculate the input voltage VA. formula 1: VA= (1/3)VDSO(2-Tc/Ti). (Based on ADRR0=0) In user applications, it is required to choose the correct value of RDS and CDS to determine the Ti value, to allow the VC value to operate between 5/6 VDSO and 1/6 VDSO. VFULL cannot be greater than 5/6 VDSO and VZERO cannot be less than 1/6 VDSO.
V
FULL
V
V
ZERO
1 /6 V D S O Ti T c (z e ro ) Tc T c ( fu ll) In te g r a te tim e D e - In te g r a te tim e
Bit No. 0
Label ADPWREN
Function Dual slope block (including input OP) power on/off switching. 0: disable Power 1: Power source comes from the regulator.
1~2
Defines the ADC discharge/charge. (ADDISCH1:0) 00: reserved ADDISCH0~ 01: charging (Integrator input connect to buffer output) ADDISCH1 10: discharging (Integrator input connect to VDSO) 11: reserved Dual Slope ADC - last stage comparator output. Read only bit, write data instructions will be ignored. During the discharging state, when the integrator output is less than the reference voltage, the ADCMPO will change from high to low. ADC integrator interrupt mode definition. These two bit define the ADCMPO data interrupt trigger mode: (ADINTM1:0)= 00: no interrupt 01: rising edge 10: falling edge 11: both edge ADC OP chopper clock source on/off switching. 0: disable 1: enable (clock value is defined by ADCD register) Unimplemented, read as 0 ADCR (18H) Register
3
ADCMPO
4~5
ADINTM0~ ADINTM1
6 7
ADCCKEN 3/4
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Bit No. Label Function Define the chopper clock (ADCCKEN should be enable), the suggestion clock is around 10kHz. The chopper clock define : 0: clock= (fSYS/32)/1 1: clock= (fSYS/32)/2 2: clock= (fSYS/32)/4 3: clock= (fSYS/32)/8 4: clock= (fSYS/32)/16 5: clock= (fSYS/32)/32 6: clock= (fSYS/32)/64 7: clock= (fSYS/32)/128 AD PGA input selection 0: from DCHOP pin 1: from TH/LB pin ADC integrator and comparator reference voltage selection 0: (VINT, VCMP) = (4/6 VDSO, 1/6 VDSO) 1: (VINT, VCMP) = (4.4/6 VDSO, 1/6 VDSO) Unimplemented, read as 0 ADC PGA gain selection 0: gain = 2 1: gain = 4 ADCD (1AH) Register
0 1 2
ADCD0 ADCD1 ADCD2
3
ADIS
4 5~6 7
ADRR0 3/4 PGAG
LCD Display Memory
The device provides an area of embedded data memory for the LCD display. This area is located at 40H to 4FH in Bank 1 of the Data Memory. The bank pointer BP enables either the General Purpose Data Memory or LCD Memory to be chosen. When BP is set to 1, any data written into location range 40H~4FH will affect the LCD display. When the BP is cleared to 0, any data written into 40H~4FH will access the general purpose data memory. The LCD display memory can be read and written to only indirectly using MP1. When data is written into the display data area, it is automatically read by the LCD driver which then generates the corresponding LCD driving signals. To turn the display on or off, a 1 or a 0 is written to the corresponding bit of the display memory, respectively. The figure illustrates the mapping between the display memory and LCD pattern for the device. The LCD clock is driven by the fSUB clock, which then passes through a divider, the division ratio of which is selected by the LCD clock selection bits LCDCK1 and LCDCK0 in the CTRL0 register to provide a LCD clock frequency of fSUB/3, fSUB/4 or fSUB/8. The LCD clock source fSUB can be derived from the LIRC or LXT oscillator selected by the selection bit named FSUBS. Note that the fSUB clock can be enabled or disabled in the power down mode by the fSUB clock control bit FSUBC in the CTRL0 register.
COM 0 1 2 3 3 2 1 40H 41H 42H 43H 4DH 4EH 4FH B it 0
SEGMENT
0
1
2
3
13
14
15
Display Memory LCD Driver Output The output structure of the device LCD driver can be 164. The LCD driver bias type is R type only. The LCD driver has a fixed 1/3 value. Low Voltage Reset Function There is a low voltage reset, LVR, circuit implemented in the microcontroller. The LVR functions can be enabled or disabled by the LVR function configuration option.
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VA VB VC VSS VA VB VC COM1 VSS VA VB VC COM2 VSS VA VB COM3 VC VSS VA VB L C D s e g m e n ts O N C O M 2 s id e lig h te d N o te : 1 /4 d u ty , 1 /3 b ia s , R ty p e : " V A " V L C D , " V B " 2 /3 V L C D , " V C " 1 /3 V L C D VC VSS
COM0
LCD Driver Output (1/4 Duty)
Bit No. 0 1 2 3 4~7
Label LCDS0 LCDS1 LCDS2 LCDS3 3/4 Select SEG 0 or IO. 0/1 : IO/SEG0 Select SEG 1 or IO. 0/1 : IO/SEG1 Select SEG 2 or IO. 0/1 : IO/SEG2 Select SEG 3 or IO. 0/1 : IO/SEG3 Unimplemented, read as 0
Function
LCDOUT Register
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The LVR has the same effect or function as the external RESB signal which performs a device reset. When in the Power Down Mode, the LVR function is disabled. The microcontroller provides a low voltage reset circuit in order to monitor the supply voltage of the device. If the supply voltage of the device is within the range 0.9V~VLVR, such as what might happen when changing a battery, the LVR will automatically reset the device internally.
V 5 .5 V
DD
The LVR includes the following specifications:
* The low voltage, which is specified as 0.9V~VLVR, has
to remain within this range for a period of time greater than 1ms. If the low voltage state does not exceed 1ms, the LVR will ignore it will not perform a reset function.
* The LVR has an OR function with the external RES
signal to perform a chip reset.
V
LVR
LVR
D e te c t V o lta g e
0 .9 V 0V R e s e t S ig n a l
R eset *1
N o r m a l O p e r a tio n *2
R eset
Low Voltage Reset Note: *1: To make sure that the system oscillator has stabilized, the SST provides an extra delay of 1024 system clock pulses before entering the normal operation. *2: Since a low voltage state has to be maintained in its original state for over 1ms, therefore after 1ms delay, the device enters the reset mode.
Operation Mode The device has two operational modes. The system clock may come from external RC (ERC), external crystal (HXT) or internal RC (HIRC) oscillator, and whose operational modes can be either Normal Mode or Power down mode. When in the Power down mode, the clocks in this device are all enabled or disabled using software. HALT Instruction Not executed Mode Normal Power Down Power Down Executed Power Down Power Down On (OSCON=1) Off (OSCON=0) On (OSCON=1) Off (OSCON=0) 0 1 Disable Enable 0 0 Off Off System Oscillator On On (OSCON=1) Off (OSCON=0) On (OSCON=1) Off (OSCON=0) FSUBC x 0 1 fSUB Clock Enable Disable Enable RTCEN x 1 1 RTC Oscillator (OSC3/OSC4) On On On
Note: The WDTOSC0:1 register should be set to enable, otherwise, the Int.RCOSC will always be disabled. Refer to the WDT section for the WDTOSC setup details.
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Bit No. 0 Label QOSC Function 32.765kHz crystal oscillator quick start-up control 0: quick start-up 1: low-power fSUB Clock source selection 0: LIRC oscillator 1: LXT oscillator fSUB Power down mode clock control 0: disabled 1: enabled
1
FSUBS
2
FSUBC
3 4
To select the LCD driver clock: 00: LCD clock = fSUB/3 LCDCK0 01: LCD clock = fSUB/4 LCDCK1 10: LCD clock = fSUB/8 11: Reserved LFS Low Frequency clock source fL selection 0: LIRC oscillator 1: LXT oscillator Timer/Event Counter 2 internal source selection 00: fL (Low frequency clock) 01: fREF (Reference frequency clock generated from Touch Key module) 10: fSEN (Sensor frequency clock generated from Touch Key module) 11: fTMCK (Gated Sensor frequency clock generated from Touch Key module) If the Touch Key module is disabled, the TCKS1 and TCKS0 bits are always set to 00 and can not be written to. CTRL0 Register
5
6 7
TCKS0 TCKS1
Bit No. 0
Label RTCEN
Function 32.768kHz oscillator (LXT) control in Power down mode 0: disabled 1: enabled Buzzer clock source selection 0: from Timer/Event Counter 0 1: from Timer/Event Counter 1 Unimplemented, read as 0 CTRL1 Register
1 2~7
BZCS 3/4
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Vibration Sensor Amplifier
The device contains a Vibration Sensor Amplifier to amplify the small electrical signals generated from vibration sensors. When the sensor is connected to the vibration input pin, VIB, and a small signal resulting from a vibration detection is generated on the VIB pin, the internal amplifier will amplify the low amplitude signal which will then be used as a wake-up source when the device is in the Power down mode. The Vibration Sensor Amplifier can be enabled or disable by the control bit, VIBREN, in the VIBRC register for power saving considerations.
V IB V ib r a tio n S ensor A m p lifie r C ir c u its V IB R E N MCU w a k e -u p
The reference key named KREF is the reference oscillator input for touch key function. When the reference key input is connected to an external capacitor together with the internal resistor and logic circuits, it forms a reference oscillator which is used to provide a reference frequency for the 12-bit reference counter. The 12-bit reference counter is used to provide a reference period selected by the reference counter overflow period selection bits RCOS1 and RCOS0 in the CFCR0 register. After the reference counter reaches the selected time-out period, the counter will stop counting and generate an interrupt signal. The reference key input KREF is also pin-shared with an I/O pin and controlled by the KREFS bit in the CFCR1 register. The four touch key inputs named TK0~TK3 are pin-shared with I/O pins and configured by the analog channel selection bits ACS0~ACS3 in the ANCS0 register to determine whether these pins are used as I/O pins or touch key analog inputs. When the four touch keys, TK0~TK3, are configured to function as touch key inputs and connected to external touch pads and combined with the internal resistor and logic circuits, it forms a touch key sensor oscillator. The sensor oscillator will generate a specific frequency different from the reference frequency when the touch key is influenced by human body contact. Touch Key Operation Before the Touch Key Module starts to function, both the reference and sensor oscillators should be enabled and the touch key inputs and analog switches should be properly setup. It is important to know that the 12-bit reference counter should first be cleared by setting the reference counter clear control bit RCCLR from 0 to 1. When the touch key module start bit CFST is set from 0 to 1, the 12-bit Counter will start to count with the synchronized reference clock fREF to provide a refer-
Bit No. 0 1~7
Label
Function
Vibration Sensor Amplifier control VIBREN 0: disabled 1: enabled 3/4 Unimplemented, read as 0 VIBRC Register
Touch Key Module
The device contains a Touch Key Module with four touch key inputs which can detect human body contact using external touch pads. The Touch Key Module includes four touch key inputs, a reference key input, a reference oscillator, a sensor oscillator and a 12-bit Counter as shown in the block diagram. Touch Key Structure The overall functions of the Touch Key Module are controlled by the Capacitor to Frequency Control Registers CFCR0 and CFCR1 and the Analog Channel Selection register ANCS0.
AS [1:0]
Touch pad 0
TK0
AS0A
AS0B
Touch pad 1
TK1
AS1A
fSEN Sensor fSENSOR Synchronizing x2 Circuits Oscillator SOEN FSENS CFST
fTMCK fSEN
AS1B
To Timer/Event Counter 2
Touch pad 2
TK2
AS2A
ENCK RCOS[1:0]
AS2B
RCCLR
Touch pad 3
TK3
AS3A
AS3B
Reference Oscillator
ROEN
fREF
12-bit Counter & Control Logic
RCOV
To Interrupt Circuits To Timer/Event Counter 2
Reference Capacitor
KREF
AS4A
fREF
Touch Key Module Block Diagram
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ence period. The reference period can be selected by the Reference Counter Overflow Selection bits RCOS1 and RCOS0 with a period ranged from 512/fREF to 4096/fREF. As the 12-bit reference counter starts to count, Timer/Event Counter 2 will also start to count using its synchronized sensor clock fTMCK. As the selected reference period time has elapsed, the reference counter will stop counting. At the same time, the module will send an interrupt signal to the MCU interrupt circuits and the synchronized sensor clock fTMCK will also be blocked. Since the fTMCK clock is blocked, Timer/Event Counter 2 will also be stopped and the count value during the reference period will be stored in the timer registers, TMR2H and TMR2L. The value obtained when the key is not touched is the untouched reference value of the corresponding key and should be stored in the RAM Data Memory. When the key is touched, the count value stored in the TMR2H and TMR2L registers will be obviously different with the untouched reference value when the key is not influenced by human body contact. By sequentially switching the touch keys and counting, users can know which keys have been touched by comparing the count value with their untouched reference value. For optimal touch switch operation it is recommended that both the reference and sensor oscillators have a frequency range of 100kHz to 1MHz. It is also recommended that the reference and sensor frequencies are as close to each other as possible for optimal operation. After the external touch key size and layout are defined, Bit No. 0 1 Label AS0 AS1 their related capacitances will then determine the sensor oscillator frequency. After this frequency is measured the reference oscillator can be adjusted to have a frequency as close as possible to this by adjusting its external reference capacitor value. A simple application program can be written by the user to measure these two internal frequencies. Touch Key Interrupt When the 12-bit reference counter overflows, the reference counter overflow flag will be set from 0 to 1 and a touch key interrupt signal will occur to get the attention of the microcontroller. When a Touch Key interrupt occurs, if the corresponding interrupt in the MCU is enabled and the stack is not full, the program will jump to the corresponding interrupt vector where it can be serviced before returning to the main program. If the related interrupt enable bits are not set, then the interrupt signal will only be a wake-up source and no interrupt will be serviced. Touch Key Registers The Capacitor to Frequency Control Register 0 named CFCR0 includes the sensor/reference oscillators enable control, the reference period selection, the touch key analog switch selection and the reference counter clear control bits. Note that when a specific touch key is selected, the other keys will be switched to ground automatically. Function Touch Key Analog Switch selection * 00: Touch Key 0 is selected, others switch to the ground. 01: Touch Key 1 is selected, others switch to the ground. 10: Touch Key 2 is selected, others switch to the ground. 11: Touch Key 3 is selected, others switch to the ground.
2
fSEN clock source selection FSENS 0: fSEN = fSENSOR 1: fSEN = fSENSOR 2 Reference Counter Overflow Period Selection 00: 512/fREF RCOS0 01: 1024/fREF RCOS1 10: 2048/fREF 11: 4096/f 12-bit Reference Counter Clear control 0(R)1: Clear the counter Others: counter unchanged RCCLR After this bit is set from 0 to 1 to clear the counter, users should then reset this bit to 0 in preparation for the next clear operation. It is recommended to clear the reference counter first before the touch key module is used. SOEN Sensor Oscillator enable control 0: disabled 1: enabled Reference Oscillator enable control 0: disabled 1: enabled CFCR0 Register
3 4
5
6
7
ROEN
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*: Truth Table of the Touch Key Analog Switch selection when pins are selected as touch key inputs. AS1 0 0 1 1 AS0 0 1 0 1 AS0A Short Open Open Open AS0B Open Short Short Short AS1A Open Short Open Open AS1B Short Open Short Short AS2A Open Open Short Open AS2B Short Short Open Short AS3A Open Open Open Short AS3B Short Short Short Open
Note: If the TKx pin is selected as an I/O pin, then the analog switches ASxA and ASxB of the TKx pin are both kept open. If the TKx pin is selected as a touch key input, the I/O input, pull-high resistor and output functions are all disabled. The x stands for the pin number from 0 to 3. The Capacitor to Frequency Control Register 1 named CFCR1 includes the touch key module start bit, the 12-bit reference counter overflow flag and the reference key function selection bit. Note that when the reference key is selected as an I/O pin, the analog switch AS4A of the reference key shown in the block diagram is kept open. Bit No. Label Function Touch Key Module Start bit. 0(R)1: enable the fTMCK output clock When this bit is set from 0 to 1, it will enable the synchronizing circuits, enable the fTMCK output clock, set the RCOV flag to 1 and the 12-bit reference counter will satrt to count. After this bit is set from 0 to 1 to enable the fTMCK clock, users should remember to reset this bit to 0 before setting this bit to 1 again. Note that when the reference counter is counting, it has no operation if this bit is re-triggered. 12-bit Reference Counter Overflow flag 0: not overflow 1: overflow occurs This bit is read only and set/cleared by hardware automatically. It is set to 1 when the 12-bit reference counter overflows and cleared to 0 when the touch key module start bit CFST is set from 0 to 1.
0
CFST
1
RCOV
2 3~7
Reference Key input function selection * KREFS 0: I/O pin 1: KREF pin 3/4 Unimplemented, read as 0
Note: *: If the reference key is selected as an I/O pin, then the KREF pin analog switch AS4A is kept open. If the KREF pin is selected as a reference key input, the I/O input, pull-high resistor and output functions are both disabled. CFCR1 Register
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The Analog Channel Selection register named ANCS0 controls the touch key input function selections. Note that when the touch key TKx is selected to be used as an I/O pin, the analog switches ASxA and ASxB of the related TKx pin, shown in the block diagram, are always kept open where x stands the pin number from 0~3. Bit No. 0 Label ACS0 Function Touch Key input 0 function selection 0: I/O pin 1: TK0 pin Touch Key input 1 function selection 0: I/O pin 1: TK1 pin Touch Key input 2 function selection 0: I/O pin 1: TK2 pin Touch Key input 3 function selection 0: I/O pin 1: TK3 pin Unimplemented, read as 0 ANCS0 Register
1
ACS1
2
ACS2
3 4~7
ACS3 3/4
Configuration Options
The following shows the options in the device. All these options should be defined in order to ensure proper functioning system. No. I/O Options 1 Port A wake-up - bit option 1. Enable 2. Disable PA0~PA6 pull-high - bit option 1. Enable 2. Disable Port B pull-high - bit option 1. Enable 2. Disable PA7 Function select 1. I/O 2. RES Options
2
3
4
LCD Options 5 LCD function in Power down mode 1. Enable 2. Disable R type drive current select 1. 50mA 2. 100mA
6
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No. Oscillator Options System oscillator select - fSYS 1. Internal RC 2. External RC 3. External XTAL Internal RC oscillator frequency select 1. 4MHz 2. 8MHz 3. 12MHz External 32KHz oscillator select 1. I/O 2. 32.768kHz external crystal System oscillator SST period selection 1. 1024 clocks 2. 2 clocks Options
7
8
9
10
Interrupt Options INT trigger edge select 1. Disable 2. Falling edge 3. Rising edge 4. Double edge
11
Watchdog Options 12 WDT function 1. Enable 2. Disable WDT clock selection - fS: 1. Internal 12kHz RC oscillator - LIRC 2. fSYS/4 3. 32.768kHz oscillator - LXT CLRWDT instruction select 1. 1 instruction 2. 2 instructions
13
14
Buzzer Options I/O or BZ function select 1. PA1/PA2 2. BZ/PA2 3. BZ/BZ
15
LVR Options 16 LVR function select 1. Disable 2. Enable LVR voltage select 1. 2.1V 2. 3.15V 3. 4.2V
17
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Application Circuits
V
DD
VDD 100kW 0 .1 m F 10kW 0 .1 m F VSS 0 .1 m F P A 7 /R E S
CO M 0~CO M 3 SEG 0~SEG 15
LCD Panel
VLCD VMAX
P A 0 /V IB P A 1 /B Z P A 2 /B Z /K R E F PB0 PB1 PB2 PB3 /T K /T K /T K /T K 1 2 3 0
L C D P o w e r S u p p ly
S e e O s c illa to r s e c tio n
OSC C ir c u it
P A 6 /O S C 1 P A 5 /O S C 2 P A 4 /O S C 3 P A 3 /O S C 4
S e e O s c illa to r s e c tio n VREG S ensor
OSC C ir c u it
VOREG
47mF
VREG
VOCHP 10mF DOPAP DOPAN VOBGP VOBGP 10mF
BRGNDEN
25kW
DOPAO CHPC1 DCHOP CHPC2 DSCC 10mF
A /D in p u t fo r th e r m a lo w b a tte r y d e te c tio n o r o th e r p u r p o s e
T H /L B VSS
47mF
300kW
DSRC DSRR H T 4 6 R 7 3 D -3
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Instruction Set
Introduction C e n t ra l t o t he s uc c es s f ul oper a t i on o f a n y microcontroller is its instruction set, which is a set of program instruction codes that directs the microcontroller to perform certain operations. In the case of Holtek microcontrollers, a comprehensive and flexible set of over 60 instructions is provided to enable programmers to implement their application with the minimum of programming overheads. For easier understanding of the various instruction codes, they have been subdivided into several functional groupings. Instruction Timing Most instructions are implemented within one instruction cycle. The exceptions to this are branch, call, or table read instructions where two instruction cycles are required. One instruction cycle is equal to 4 system clock cycles, therefore in the case of an 8MHz system oscillator, most instructions would be implemented within 0.5ms and branch or call instructions would be implemented within 1ms. Although instructions which require one more cycle to implement are generally limited to the JMP, CALL, RET, RETI and table read instructions, it is important to realize that any other instructions which involve manipulation of the Program Counter Low register or PCL will also take one more cycle to implement. As instructions which change the contents of the PCL will imply a direct jump to that new address, one more cycle will be required. Examples of such instructions would be CLR PCL or MOV PCL, A. For the case of skip instructions, it must be noted that if the result of the comparison involves a skip operation then this will also take one more cycle, if no skip is involved then only one cycle is required. Moving and Transferring Data The transfer of data within the microcontroller program is one of the most frequently used operations. Making use of three kinds of MOV instructions, data can be transferred from registers to the Accumulator and vice-versa as well as being able to move specific immediate data directly into the Accumulator. One of the most important data transfer applications is to receive data from the input ports and transfer data to the output ports. Arithmetic Operations The ability to perform certain arithmetic operations and data manipulation is a necessary feature of most microcontroller applications. Within the Holtek microcontroller instruction set are a range of add and subtract instruction mnemonics to enable the necessary arithmetic to be carried out. Care must be taken to ensure correct handling of carry and borrow data when results exceed 255 for addition and less than 0 for subtraction. The increment and decrement instructions INC, INCA, DEC and DECA provide a simple means of increasing or decreasing by a value of one of the values in the destination specified. Logical and Rotate Operations The standard logical operations such as AND, OR, XOR and CPL all have their own instruction within the Holtek microcontroller instruction set. As with the case of most instructions involving data manipulation, data must pass through the Accumulator which may involve additional programming steps. In all logical data operations, the zero flag may be set if the result of the operation is zero. Another form of logical data manipulation comes from the rotate instructions such as RR, RL, RRC and RLC which provide a simple means of rotating one bit right or left. Different rotate instructions exist depending on program requirements. Rotate instructions are useful for serial port programming applications where data can be rotated from an internal register into the Carry bit from where it can be examined and the necessary serial bit set high or low. Another application where rotate data operations are used is to implement multiplication and division calculations. Branches and Control Transfer Program branching takes the form of either jumps to specified locations using the JMP instruction or to a subroutine using the CALL instruction. They differ in the sense that in the case of a subroutine call, the program must return to the instruction immediately when the subroutine has been carried out. This is done by placing a return instruction RET in the subroutine which will cause the program to jump back to the address right after the CALL instruction. In the case of a JMP instruction, the program simply jumps to the desired location. There is no requirement to jump back to the original jumping off point as in the case of the CALL instruction. One special and extremely useful set of branch instructions are the conditional branches. Here a decision is first made regarding the condition of a certain data memory or individual bits. Depending upon the conditions, the program will continue with the next instruction or skip over it and jump to the following instruction. These instructions are the key to decision making and branching within the program perhaps determined by the condition of certain input switches or by the condition of internal data bits.
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Bit Operations The ability to provide single bit operations on Data Memory is an extremely flexible feature of all Holtek microcontrollers. This feature is especially useful for output port bit programming where individual bits or port pins can be directly set high or low using either the SET [m].i or CLR [m].i instructions respectively. The feature removes the need for programmers to first read the 8-bit output port, manipulate the input data to ensure that other bits are not changed and then output the port with the correct new data. This read-modify-write process is taken care of automatically when these bit operation instructions are used. Table Read Operations Data storage is normally implemented by using registers. However, when working with large amounts of fixed data, the volume involved often makes it inconvenient to store the fixed data in the Data Memory. To overcome this problem, Holtek microcontrollers allow an area of Program Memory to be setup as a table where data can be directly stored. A set of easy to use instructions provides the means by which this fixed data can be referenced and retrieved from the Program Memory. Other Operations In addition to the above functional instructions, a range of other instructions also exist such as the HALT instruction for Power-down operations and instructions to control the operation of the Watchdog Timer for reliable program operations under extreme electric or electromagnetic environments. For their relevant operations, refer to the functional related sections. Instruction Set Summary The following table depicts a summary of the instruction set categorised according to function and can be consulted as a basic instruction reference using the following listed conventions. Table conventions: x: Bits immediate data m: Data Memory address A: Accumulator i: 0~7 number of bits addr: Program memory address
Mnemonic Arithmetic ADD A,[m] ADDM A,[m] ADD A,x ADC A,[m] ADCM A,[m] SUB A,x SUB A,[m] SUBM A,[m] SBC A,[m] SBCM A,[m] DAA [m] AND A,[m] OR A,[m] XOR A,[m] ANDM A,[m] ORM A,[m] XORM A,[m] AND A,x OR A,x XOR A,x CPL [m] CPLA [m] INCA [m] INC [m] DECA [m] DEC [m]
Description Add Data Memory to ACC Add ACC to Data Memory Add immediate data to ACC Add Data Memory to ACC with Carry Add ACC to Data memory with Carry Subtract immediate data from the ACC Subtract Data Memory from ACC Subtract Data Memory from ACC with result in Data Memory Subtract Data Memory from ACC with Carry Subtract Data Memory from ACC with Carry, result in Data Memory Decimal adjust ACC for Addition with result in Data Memory Logical AND Data Memory to ACC Logical OR Data Memory to ACC Logical XOR Data Memory to ACC Logical AND ACC to Data Memory Logical OR ACC to Data Memory Logical XOR ACC to Data Memory Logical AND immediate Data to ACC Logical OR immediate Data to ACC Logical XOR immediate Data to ACC Complement Data Memory Complement Data Memory with result in ACC Increment Data Memory with result in ACC Increment Data Memory Decrement Data Memory with result in ACC Decrement Data Memory
Cycles 1 1Note 1 1 1Note 1 1 1Note 1 1Note 1Note 1 1 1 1Note 1Note 1Note 1 1 1 1Note 1 1 1Note 1 1Note
Flag Affected Z, C, AC, OV Z, C, AC, OV Z, C, AC, OV Z, C, AC, OV Z, C, AC, OV Z, C, AC, OV Z, C, AC, OV Z, C, AC, OV Z, C, AC, OV Z, C, AC, OV C Z Z Z Z Z Z Z Z Z Z Z Z Z Z Z
Logic Operation
Increment & Decrement
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Mnemonic Rotate RRA [m] RR [m] RRCA [m] RRC [m] RLA [m] RL [m] RLCA [m] RLC [m] Data Move MOV A,[m] MOV [m],A MOV A,x Bit Operation CLR [m].i SET [m].i Branch JMP addr SZ [m] SZA [m] SZ [m].i SNZ [m].i SIZ [m] SDZ [m] SIZA [m] SDZA [m] CALL addr RET RET A,x RETI Table Read TABRDC [m] TABRDL [m] Miscellaneous NOP CLR [m] SET [m] CLR WDT CLR WDT1 CLR WDT2 SWAP [m] SWAPA [m] HALT No operation Clear Data Memory Set Data Memory Clear Watchdog Timer Pre-clear Watchdog Timer Pre-clear Watchdog Timer Swap nibbles of Data Memory Swap nibbles of Data Memory with result in ACC Enter power down mode 1 1Note 1Note 1 1 1 1Note 1 1 None None None TO, PDF TO, PDF TO, PDF None None TO, PDF Read table (current page) to TBLH and Data Memory Read table (last page) to TBLH and Data Memory 2Note 2Note None None Jump unconditionally Skip if Data Memory is zero Skip if Data Memory is zero with data movement to ACC Skip if bit i of Data Memory is zero Skip if bit i of Data Memory is not zero Skip if increment Data Memory is zero Skip if decrement Data Memory is zero Skip if increment Data Memory is zero with result in ACC Skip if decrement Data Memory is zero with result in ACC Subroutine call Return from subroutine Return from subroutine and load immediate data to ACC Return from interrupt 2 1Note 1note 1Note 1Note 1Note 1Note 1Note 1Note 2 2 2 2 None None None None None None None None None None None None None Clear bit of Data Memory Set bit of Data Memory 1Note 1Note None None Move Data Memory to ACC Move ACC to Data Memory Move immediate data to ACC 1 1Note 1 None None None Rotate Data Memory right with result in ACC Rotate Data Memory right Rotate Data Memory right through Carry with result in ACC Rotate Data Memory right through Carry Rotate Data Memory left with result in ACC Rotate Data Memory left Rotate Data Memory left through Carry with result in ACC Rotate Data Memory left through Carry 1 1Note 1 1Note 1 1Note 1 1Note None None C C None None C C Description Cycles Flag Affected
Note: 1. For skip instructions, if the result of the comparison involves a skip then two cycles are required, if no skip takes place only one cycle is required. 2. Any instruction which changes the contents of the PCL will also require 2 cycles for execution. 3. For the CLR WDT1 and CLR WDT2 instructions the TO and PDF flags may be affected by the execution status. The TO and PDF flags are cleared after both CLR WDT1 and CLR WDT2 instructions are consecutively executed. Otherwise the TO and PDF flags remain unchanged.
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Instruction Definition
ADC A,[m] Description Operation Affected flag(s) ADCM A,[m] Description Operation Affected flag(s) ADD A,[m] Description Operation Affected flag(s) ADD A,x Description Operation Affected flag(s) ADDM A,[m] Description Operation Affected flag(s) AND A,[m] Description Operation Affected flag(s) AND A,x Description Operation Affected flag(s) ANDM A,[m] Description Operation Affected flag(s) Rev. 1.10 Add Data Memory to ACC with Carry The contents of the specified Data Memory, Accumulator and the carry flag are added. The result is stored in the Accumulator. ACC ACC + [m] + C OV, Z, AC, C Add ACC to Data Memory with Carry The contents of the specified Data Memory, Accumulator and the carry flag are added. The result is stored in the specified Data Memory. [m] ACC + [m] + C OV, Z, AC, C Add Data Memory to ACC The contents of the specified Data Memory and the Accumulator are added. The result is stored in the Accumulator. ACC ACC + [m] OV, Z, AC, C Add immediate data to ACC The contents of the Accumulator and the specified immediate data are added. The result is stored in the Accumulator. ACC ACC + x OV, Z, AC, C Add ACC to Data Memory The contents of the specified Data Memory and the Accumulator are added. The result is stored in the specified Data Memory. [m] ACC + [m] OV, Z, AC, C Logical AND Data Memory to ACC Data in the Accumulator and the specified Data Memory perform a bitwise logical AND operation. The result is stored in the Accumulator. ACC ACC AND [m] Z Logical AND immediate data to ACC Data in the Accumulator and the specified immediate data perform a bitwise logical AND operation. The result is stored in the Accumulator. ACC ACC AND x Z Logical AND ACC to Data Memory Data in the specified Data Memory and the Accumulator perform a bitwise logical AND operation. The result is stored in the Data Memory. [m] ACC AND [m] Z 43 April 19, 2010
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CALL addr Description Subroutine call Unconditionally calls a subroutine at the specified address. The Program Counter then increments by 1 to obtain the address of the next instruction which is then pushed onto the stack. The specified address is then loaded and the program continues execution from this new address. As this instruction requires an additional operation, it is a two cycle instruction. Stack Program Counter + 1 Program Counter addr None Clear Data Memory Each bit of the specified Data Memory is cleared to 0. [m] 00H None Clear bit of Data Memory Bit i of the specified Data Memory is cleared to 0. [m].i 0 None Clear Watchdog Timer The TO, PDF flags and the WDT are all cleared. WDT cleared TO 0 PDF 0 TO, PDF Pre-clear Watchdog Timer The TO, PDF flags and the WDT are all cleared. Note that this instruction works in conjunction with CLR WDT2 and must be executed alternately with CLR WDT2 to have effect. Repetitively executing this instruction without alternately executing CLR WDT2 will have no effect. WDT cleared TO 0 PDF 0 TO, PDF Pre-clear Watchdog Timer The TO, PDF flags and the WDT are all cleared. Note that this instruction works in conjunction with CLR WDT1 and must be executed alternately with CLR WDT1 to have effect. Repetitively executing this instruction without alternately executing CLR WDT1 will have no effect. WDT cleared TO 0 PDF 0 TO, PDF
Operation
Affected flag(s) CLR [m] Description Operation Affected flag(s) CLR [m].i Description Operation Affected flag(s) CLR WDT Description Operation
Affected flag(s) CLR WDT1 Description
Operation
Affected flag(s) CLR WDT2 Description
Operation
Affected flag(s)
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CPL [m] Description Operation Affected flag(s) CPLA [m] Description Complement Data Memory Each bit of the specified Data Memory is logically complemented (1s complement). Bits which previously contained a 1 are changed to 0 and vice versa. [m] [m] Z Complement Data Memory with result in ACC Each bit of the specified Data Memory is logically complemented (1s complement). Bits which previously contained a 1 are changed to 0 and vice versa. The complemented result is stored in the Accumulator and the contents of the Data Memory remain unchanged. ACC [m] Z Decimal-Adjust ACC for addition with result in Data Memory Convert the contents of the Accumulator value to a BCD ( Binary Coded Decimal) value resulting from the previous addition of two BCD variables. If the low nibble is greater than 9 or if AC flag is set, then a value of 6 will be added to the low nibble. Otherwise the low nibble remains unchanged. If the high nibble is greater than 9 or if the C flag is set, then a value of 6 will be added to the high nibble. Essentially, the decimal conversion is performed by adding 00H, 06H, 60H or 66H depending on the Accumulator and flag conditions. Only the C flag may be affected by this instruction which indicates that if the original BCD sum is greater than 100, it allows multiple precision decimal addition. [m] ACC + 00H or [m] ACC + 06H or [m] ACC + 60H or [m] ACC + 66H C Decrement Data Memory Data in the specified Data Memory is decremented by 1. [m] [m] - 1 Z Decrement Data Memory with result in ACC Data in the specified Data Memory is decremented by 1. The result is stored in the Accumulator. The contents of the Data Memory remain unchanged. ACC [m] - 1 Z Enter power down mode This instruction stops the program execution and turns off the system clock. The contents of the Data Memory and registers are retained. The WDT and prescaler are cleared. The power down flag PDF is set and the WDT time-out flag TO is cleared. TO 0 PDF 1 TO, PDF
Operation Affected flag(s) DAA [m] Description
Operation
Affected flag(s) DEC [m] Description Operation Affected flag(s) DECA [m] Description Operation Affected flag(s) HALT Description
Operation
Affected flag(s)
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INC [m] Description Operation Affected flag(s) INCA [m] Description Operation Affected flag(s) JMP addr Description Increment Data Memory Data in the specified Data Memory is incremented by 1. [m] [m] + 1 Z Increment Data Memory with result in ACC Data in the specified Data Memory is incremented by 1. The result is stored in the Accumulator. The contents of the Data Memory remain unchanged. ACC [m] + 1 Z Jump unconditionally The contents of the Program Counter are replaced with the specified address. Program execution then continues from this new address. As this requires the insertion of a dummy instruction while the new address is loaded, it is a two cycle instruction. Program Counter addr None Move Data Memory to ACC The contents of the specified Data Memory are copied to the Accumulator. ACC [m] None Move immediate data to ACC The immediate data specified is loaded into the Accumulator. ACC x None Move ACC to Data Memory The contents of the Accumulator are copied to the specified Data Memory. [m] ACC None No operation No operation is performed. Execution continues with the next instruction. No operation None Logical OR Data Memory to ACC Data in the Accumulator and the specified Data Memory perform a bitwise logical OR operation. The result is stored in the Accumulator. ACC ACC OR [m] Z
Operation Affected flag(s) MOV A,[m] Description Operation Affected flag(s) MOV A,x Description Operation Affected flag(s) MOV [m],A Description Operation Affected flag(s) NOP Description Operation Affected flag(s) OR A,[m] Description Operation Affected flag(s)
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OR A,x Description Operation Affected flag(s) ORM A,[m] Description Operation Affected flag(s) RET Description Operation Affected flag(s) RET A,x Description Operation Logical OR immediate data to ACC Data in the Accumulator and the specified immediate data perform a bitwise logical OR operation. The result is stored in the Accumulator. ACC ACC OR x Z Logical OR ACC to Data Memory Data in the specified Data Memory and the Accumulator perform a bitwise logical OR operation. The result is stored in the Data Memory. [m] ACC OR [m] Z Return from subroutine The Program Counter is restored from the stack. Program execution continues at the restored address. Program Counter Stack None Return from subroutine and load immediate data to ACC The Program Counter is restored from the stack and the Accumulator loaded with the specified immediate data. Program execution continues at the restored address. Program Counter Stack ACC x None Return from interrupt The Program Counter is restored from the stack and the interrupts are re-enabled by setting the EMI bit. EMI is the enable master (global) interrupt bit (bit 0; register INTC). If an interrupt was pending when the RETI instruction is executed, the pending Interrupt routine will be processed before returning to the main program. Program Counter Stack EMI 1 None Rotate Data Memory left The contents of the specified Data Memory are rotated left by 1 bit with bit 7 rotated into bit 0. [m].(i+1) [m].i; (i = 0~6) [m].0 [m].7 None Rotate Data Memory left with result in ACC The contents of the specified Data Memory are rotated left by 1 bit with bit 7 rotated into bit 0. The rotated result is stored in the Accumulator and the contents of the Data Memory remain unchanged. ACC.(i+1) [m].i; (i = 0~6) ACC.0 [m].7 None
Affected flag(s) RETI Description
Operation
Affected flag(s) RL [m] Description Operation
Affected flag(s) RLA [m] Description
Operation
Affected flag(s)
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RLC [m] Description Operation Rotate Data Memory left through Carry The contents of the specified Data Memory and the carry flag are rotated left by 1 bit. Bit 7 replaces the Carry bit and the original carry flag is rotated into bit 0. [m].(i+1) [m].i; (i = 0~6) [m].0 C C [m].7 C Rotate Data Memory left through Carry with result in ACC Data in the specified Data Memory and the carry flag are rotated left by 1 bit. Bit 7 replaces the Carry bit and the original carry flag is rotated into the bit 0. The rotated result is stored in the Accumulator and the contents of the Data Memory remain unchanged. ACC.(i+1) [m].i; (i = 0~6) ACC.0 C C [m].7 C Rotate Data Memory right The contents of the specified Data Memory are rotated right by 1 bit with bit 0 rotated into bit 7. [m].i [m].(i+1); (i = 0~6) [m].7 [m].0 None Rotate Data Memory right with result in ACC Data in the specified Data Memory and the carry flag are rotated right by 1 bit with bit 0 rotated into bit 7. The rotated result is stored in the Accumulator and the contents of the Data Memory remain unchanged. ACC.i [m].(i+1); (i = 0~6) ACC.7 [m].0 None Rotate Data Memory right through Carry The contents of the specified Data Memory and the carry flag are rotated right by 1 bit. Bit 0 replaces the Carry bit and the original carry flag is rotated into bit 7. [m].i [m].(i+1); (i = 0~6) [m].7 C C [m].0 C Rotate Data Memory right through Carry with result in ACC Data in the specified Data Memory and the carry flag are rotated right by 1 bit. Bit 0 replaces the Carry bit and the original carry flag is rotated into bit 7. The rotated result is stored in the Accumulator and the contents of the Data Memory remain unchanged. ACC.i [m].(i+1); (i = 0~6) ACC.7 C C [m].0 C
Affected flag(s) RLCA [m] Description
Operation
Affected flag(s) RR [m] Description Operation
Affected flag(s) RRA [m] Description
Operation
Affected flag(s) RRC [m] Description Operation
Affected flag(s) RRCA [m] Description
Operation
Affected flag(s)
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SBC A,[m] Description Subtract Data Memory from ACC with Carry The contents of the specified Data Memory and the complement of the carry flag are subtracted from the Accumulator. The result is stored in the Accumulator. Note that if the result of subtraction is negative, the C flag will be cleared to 0, otherwise if the result is positive or zero, the C flag will be set to 1. ACC ACC - [m] - C OV, Z, AC, C Subtract Data Memory from ACC with Carry and result in Data Memory The contents of the specified Data Memory and the complement of the carry flag are subtracted from the Accumulator. The result is stored in the Data Memory. Note that if the result of subtraction is negative, the C flag will be cleared to 0, otherwise if the result is positive or zero, the C flag will be set to 1. [m] ACC - [m] - C OV, Z, AC, C Skip if decrement Data Memory is 0 The contents of the specified Data Memory are first decremented by 1. If the result is 0 the following instruction is skipped. As this requires the insertion of a dummy instruction while the next instruction is fetched, it is a two cycle instruction. If the result is not 0 the program proceeds with the following instruction. [m] [m] - 1 Skip if [m] = 0 None Skip if decrement Data Memory is zero with result in ACC The contents of the specified Data Memory are first decremented by 1. If the result is 0, the following instruction is skipped. The result is stored in the Accumulator but the specified Data Memory contents remain unchanged. As this requires the insertion of a dummy instruction while the next instruction is fetched, it is a two cycle instruction. If the result is not 0, the program proceeds with the following instruction. ACC [m] - 1 Skip if ACC = 0 None Set Data Memory Each bit of the specified Data Memory is set to 1. [m] FFH None Set bit of Data Memory Bit i of the specified Data Memory is set to 1. [m].i 1 None
Operation Affected flag(s) SBCM A,[m] Description
Operation Affected flag(s) SDZ [m] Description
Operation Affected flag(s) SDZA [m] Description
Operation
Affected flag(s) SET [m] Description Operation Affected flag(s) SET [m].i Description Operation Affected flag(s)
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SIZ [m] Description Skip if increment Data Memory is 0 The contents of the specified Data Memory are first incremented by 1. If the result is 0, the following instruction is skipped. As this requires the insertion of a dummy instruction while the next instruction is fetched, it is a two cycle instruction. If the result is not 0 the program proceeds with the following instruction. [m] [m] + 1 Skip if [m] = 0 None Skip if increment Data Memory is zero with result in ACC The contents of the specified Data Memory are first incremented by 1. If the result is 0, the following instruction is skipped. The result is stored in the Accumulator but the specified Data Memory contents remain unchanged. As this requires the insertion of a dummy instruction while the next instruction is fetched, it is a two cycle instruction. If the result is not 0 the program proceeds with the following instruction. ACC [m] + 1 Skip if ACC = 0 None Skip if bit i of Data Memory is not 0 If bit i of the specified Data Memory is not 0, the following instruction is skipped. As this requires the insertion of a dummy instruction while the next instruction is fetched, it is a two cycle instruction. If the result is 0 the program proceeds with the following instruction. Skip if [m].i 0 None Subtract Data Memory from ACC The specified Data Memory is subtracted from the contents of the Accumulator. The result is stored in the Accumulator. Note that if the result of subtraction is negative, the C flag will be cleared to 0, otherwise if the result is positive or zero, the C flag will be set to 1. ACC ACC - [m] OV, Z, AC, C Subtract Data Memory from ACC with result in Data Memory The specified Data Memory is subtracted from the contents of the Accumulator. The result is stored in the Data Memory. Note that if the result of subtraction is negative, the C flag will be cleared to 0, otherwise if the result is positive or zero, the C flag will be set to 1. [m] ACC - [m] OV, Z, AC, C Subtract immediate data from ACC The immediate data specified by the code is subtracted from the contents of the Accumulator. The result is stored in the Accumulator. Note that if the result of subtraction is negative, the C flag will be cleared to 0, otherwise if the result is positive or zero, the C flag will be set to 1. ACC ACC - x OV, Z, AC, C
Operation Affected flag(s) SIZA [m] Description
Operation Affected flag(s) SNZ [m].i Description
Operation Affected flag(s) SUB A,[m] Description
Operation Affected flag(s) SUBM A,[m] Description
Operation Affected flag(s) SUB A,x Description
Operation Affected flag(s)
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SWAP [m] Description Operation Affected flag(s) SWAPA [m] Description Operation Swap nibbles of Data Memory The low-order and high-order nibbles of the specified Data Memory are interchanged. [m].3~[m].0 [m].7 ~ [m].4 None Swap nibbles of Data Memory with result in ACC The low-order and high-order nibbles of the specified Data Memory are interchanged. The result is stored in the Accumulator. The contents of the Data Memory remain unchanged. ACC.3 ~ ACC.0 [m].7 ~ [m].4 ACC.7 ~ ACC.4 [m].3 ~ [m].0 None Skip if Data Memory is 0 If the contents of the specified Data Memory is 0, the following instruction is skipped. As this requires the insertion of a dummy instruction while the next instruction is fetched, it is a two cycle instruction. If the result is not 0 the program proceeds with the following instruction. Skip if [m] = 0 None Skip if Data Memory is 0 with data movement to ACC The contents of the specified Data Memory are copied to the Accumulator. If the value is zero, the following instruction is skipped. As this requires the insertion of a dummy instruction while the next instruction is fetched, it is a two cycle instruction. If the result is not 0 the program proceeds with the following instruction. ACC [m] Skip if [m] = 0 None Skip if bit i of Data Memory is 0 If bit i of the specified Data Memory is 0, the following instruction is skipped. As this requires the insertion of a dummy instruction while the next instruction is fetched, it is a two cycle instruction. If the result is not 0, the program proceeds with the following instruction. Skip if [m].i = 0 None Read table (current page) to TBLH and Data Memory The low byte of the program code (current page) addressed by the table pointer (TBLP) is moved to the specified Data Memory and the high byte moved to TBLH. [m] program code (low byte) TBLH program code (high byte) None Read table (last page) to TBLH and Data Memory The low byte of the program code (last page) addressed by the table pointer (TBLP) is moved to the specified Data Memory and the high byte moved to TBLH. [m] program code (low byte) TBLH program code (high byte) None
Affected flag(s) SZ [m] Description
Operation Affected flag(s) SZA [m] Description
Operation Affected flag(s) SZ [m].i Description
Operation Affected flag(s) TABRDC [m] Description Operation
Affected flag(s) TABRDL [m] Description Operation
Affected flag(s)
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XOR A,[m] Description Operation Affected flag(s) XORM A,[m] Description Operation Affected flag(s) XOR A,x Description Operation Affected flag(s) Logical XOR Data Memory to ACC Data in the Accumulator and the specified Data Memory perform a bitwise logical XOR operation. The result is stored in the Accumulator. ACC ACC XOR [m] Z Logical XOR ACC to Data Memory Data in the specified Data Memory and the Accumulator perform a bitwise logical XOR operation. The result is stored in the Data Memory. [m] ACC XOR [m] Z Logical XOR immediate data to ACC Data in the Accumulator and the specified immediate data perform a bitwise logical XOR operation. The result is stored in the Accumulator. ACC ACC XOR x Z
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Package Information
52-pin QFP (14mm14mm) Outline Dimensions
C D 39 27 G H
I 40 26 F A B E
52
14 K J 1 13
Symbol A B C D E F G H I J K L a Symbol A B C D E F G H I J K a
Dimensions in inch Min. 0.681 0.547 0.681 0.547 3/4 3/4 0.098 3/4 3/4 0.029 0.004 3/4 0 Nom. 3/4 3/4 3/4 3/4 0.039 0.016 3/4 3/4 0.004 3/4 3/4 0.004 3/4 Dimensions in mm Min. 17.30 13.90 17.30 13.90 3/4 3/4 2.50 3/4 3/4 0.73 0.10 0 Nom. 3/4 3/4 3/4 3/4 1.00 0.40 3/4 3/4 0.10 3/4 3/4 3/4 Max. 17.50 14.10 17.50 14.10 3/4 3/4 3.10 3.40 3/4 1.03 0.20 7 Max. 0.689 0.555 0.689 0.555 3/4 3/4 0.122 0.134 3/4 0.041 0.008 3/4 7
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Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Taipei Sales Office) 4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan Tel: 886-2-2655-7070 Fax: 886-2-2655-7373 Fax: 886-2-2655-7383 (International sales hotline) Holtek Semiconductor Inc. (Shenzhen Sales Office) 5F, Unit A, Productivity Building, No.5 Gaoxin M 2nd Road, Nanshan District, Shenzhen, China 518057 Tel: 86-755-8616-9908, 86-755-8616-9308 Fax: 86-755-8616-9722 Holtek Semiconductor (USA), Inc. (North America Sales Office) 46729 Fremont Blvd., Fremont, CA 94538, USA Tel: 1-510-252-9880 Fax: 1-510-252-9885 http://www.holtek.com
Copyright O 2010 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holteks products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw.
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